{"title":"In Situ O₂ Plasma-Treated HfO₂–ZrO₂ Superlattice HZO FeRAMs Exhibiting Enhanced Remnant Polarization and Improved Endurance Performance","authors":"Dong-Ru Hsieh;Zi-Yang Hong;Wei-Ju Yeh;Jia-Chian Ni;Huai-En Luo;Yan-Kui Liang;Chun-Hsiung Lin;Tien-Sheng Chao","doi":"10.1109/TED.2024.3509401","DOIUrl":null,"url":null,"abstract":"In this study, HfO2–ZrO2 superlattice (SL) HfZrO2 (HZO) ferroelectric random access memories (FeRAMs) with various HfO2/ZrO2 nanolamination (NL) thicknesses and a 1.5-nm ZrO2 seed layer were fabricated without and with in situ O2 plasma treatment to experimentally investigate and discuss their ferroelectricity and endurance performance. Compared with the conventional HZO FeRAMs, the HfO2–ZrO2 SL HZO FeRAMs with a HfO2 and ZrO2 NL thickness of 1 nm exhibited a higher two remnant polarization (\n<inline-formula> <tex-math>$2{P} _{\\text {r}}$ </tex-math></inline-formula>\n) of \n<inline-formula> <tex-math>$43.32~\\mu $ </tex-math></inline-formula>\nC/cm2, nearly wake-up free behavior, stronger fatigue effect immunity, and lower two coercive field (\n<inline-formula> <tex-math>$2{E} _{\\text {c}}$ </tex-math></inline-formula>\n) of 2.55 MV/cm. Furthermore, by using an in situ O2 plasma-treated SL HZO thin film for the FeRAMs to greatly suppress the oxygen vacancy generation during cycling, a further improved fatigue effect immunity and significantly reduced pulsed \n<inline-formula> <tex-math>$2{P} _{\\text {r}}$ </tex-math></inline-formula>\n degradation rate (\n<inline-formula> <tex-math>$\\Delta 2{P} _{\\text {r}}$ </tex-math></inline-formula>\n/\n<inline-formula> <tex-math>$2{P} _{\\text {r,pristine}}$ </tex-math></inline-formula>\n) down to 36.48% after the endurance test of \n<inline-formula> <tex-math>$10^{{9}}$ </tex-math></inline-formula>\n cycles can be achieved because the in situ O2 plasma-treated SL HZO FeRAMs possess a significantly enhanced HZO thin-film quality. Therefore, the in situ O2 plasma-treated SL HZO FeRAMs are very suitable candidates for embedded nonvolatile memory (eNVM) applications.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 1","pages":"259-265"},"PeriodicalIF":2.9000,"publicationDate":"2024-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10787441/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, HfO2–ZrO2 superlattice (SL) HfZrO2 (HZO) ferroelectric random access memories (FeRAMs) with various HfO2/ZrO2 nanolamination (NL) thicknesses and a 1.5-nm ZrO2 seed layer were fabricated without and with in situ O2 plasma treatment to experimentally investigate and discuss their ferroelectricity and endurance performance. Compared with the conventional HZO FeRAMs, the HfO2–ZrO2 SL HZO FeRAMs with a HfO2 and ZrO2 NL thickness of 1 nm exhibited a higher two remnant polarization (
$2{P} _{\text {r}}$
) of
$43.32~\mu $
C/cm2, nearly wake-up free behavior, stronger fatigue effect immunity, and lower two coercive field (
$2{E} _{\text {c}}$
) of 2.55 MV/cm. Furthermore, by using an in situ O2 plasma-treated SL HZO thin film for the FeRAMs to greatly suppress the oxygen vacancy generation during cycling, a further improved fatigue effect immunity and significantly reduced pulsed
$2{P} _{\text {r}}$
degradation rate (
$\Delta 2{P} _{\text {r}}$
/
$2{P} _{\text {r,pristine}}$
) down to 36.48% after the endurance test of
$10^{{9}}$
cycles can be achieved because the in situ O2 plasma-treated SL HZO FeRAMs possess a significantly enhanced HZO thin-film quality. Therefore, the in situ O2 plasma-treated SL HZO FeRAMs are very suitable candidates for embedded nonvolatile memory (eNVM) applications.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.