High-Performance Junctionless Ferroelectric Thin-Film Transistor for Low-Voltage and High-Speed Nonvolatile Memory Applications

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-11-27 DOI:10.1109/TED.2024.3503539
William Cheng-Yu Ma;Chun-Jung Su;Kuo-Hsing Kao;Yu-Chieh Yen;Ji-Min Yang;Yi-Han Li;Yen-Chen Chen;Jhe-Yu Lin;Hui-Wen Chang
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Abstract

A junctionless ferroelectric thin-film transistor (JL-FeTFT) that combines a highly doped polycrystalline-silicon (poly-Si) channel with a ferroelectric gate insulator is proposed and investigates its nonvolatile memory (NVM) characteristics for application in high-density vertically stacked memory structures in neuromorphic computing. Compared to the conventional inversion mode FeTFT (IM-FeTFT) with undoped poly-Si channel, the JL-FeTFT demonstrates significant advantages. First, the JL-FeTFT operates at a lower voltage due to the higher electron concentration in the channel, resulting in a reduction of the threshold voltage ( ${V} _{\text {TH}}$ ) by 0.522 V. Second, the transconductance of JL-FeTFT is 6.28 times higher than that of IM-FeTFT. Additionally, the ${V} _{\text {TH}}$ modulation in JL-FeTFT is significantly higher than in IM-FeTFT across various pulse widths, particularly excelling under short pulse widths and low operating voltages. Furthermore, the JL-FeTFT exhibits endurance of $2\times 10^{{5}}$ cycles at a 300 ns pulsewidth, substantially surpassing the $5\times 10^{{4}}$ cycles of the IM-FeTFT. The JL-FeTFT also shows better stability and reliability, with a smaller reduction in the memory window (MW) after up to 106 program/erase (PRG/ERS) cycles. Moreover, after 106 PRG/ERS cycles, the JL-FeTFT maintains lower degradation in ON-current, subthreshold swing (SS), and transconductance compared to the IM-FeTFT. Additionally, the JL-FeTFT operates at lower voltages and achieves endurance of 105 cycles at a 100 ns pulsewidth, making it suitable for high-speed and low-voltage NVM applications. Consequently, the JL-FeTFT demonstrates advantages in terms of low operating voltage, high ON-current, excellent endurance, and reliability, positioning it as a promising candidate for future high-density and high-performance memory.
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用于低电压和高速非易失性存储器的高性能无结铁电薄膜晶体管
提出了一种结合高掺杂多晶硅沟道和铁电栅绝缘体的无结铁电薄膜晶体管(JL-FeTFT),并研究了其非易失性存储(NVM)特性,用于高密度垂直堆叠存储结构在神经形态计算中的应用。与未掺杂多晶硅沟道的传统反转模式场效应晶体管(IM-FeTFT)相比,JL-FeTFT具有显著的优势。首先,由于通道中较高的电子浓度,JL-FeTFT在较低的电压下工作,导致阈值电压(${V} _{\text {TH}}$)降低0.522 V。第二,JL-FeTFT的跨导是IM-FeTFT的6.28倍。此外,在各种脉冲宽度下,JL-FeTFT中的${V} _{\text {TH}}$调制明显高于IM-FeTFT,特别是在短脉冲宽度和低工作电压下表现优异。此外,JL-FeTFT在300 ns脉冲宽度下的续航时间为$2\ × 10^{{4}}$,大大超过了IM-FeTFT的$5\ × 10^{{4}}$周期。JL-FeTFT还显示出更好的稳定性和可靠性,在多达106个程序/擦除(PRG/ERS)周期后,存储器窗口(MW)的减少较小。此外,在106个PRG/ERS周期后,与IM-FeTFT相比,JL-FeTFT在导通电流、亚阈值摆幅(SS)和跨导方面保持较低的退化。此外,JL-FeTFT在较低的电压下工作,并在100 ns脉冲宽度下实现105个周期的续航时间,使其适用于高速和低压NVM应用。因此,jl - fet在低工作电压、高导通电流、优异的耐用性和可靠性方面表现出优势,将其定位为未来高密度和高性能存储器的有希望的候选者。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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