RRAM-Based Single Device for Vector Multiplication and Multibit Storage With Ultrahigh Area Efficiency

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-12-04 DOI:10.1109/TED.2024.3508666
Yang Shen;Zhoujie Pan;Mengge Jin;Jintian Gao;Yabin Sun;He Tian;Tian-Ling Ren
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Abstract

Considering that Von Neumann architecture has bottlenecks in both speed and power consumption, in-memory computation is a promising solution. The in-memory computation needs to be carried out in an array composed of storage units, which can be resistive random access memory (RRAM). When using RRAMs, the data storage density can be increased by taking advantage of their multiresistive state characteristics. However, the lack of reliability is a common problem of RRAM, and it is difficult to realize high long range cyclic characteristics purely from the principle. In this work, a new 3-D device based on RRAM is proposed, which is able to realize 2-bit vector multiplication and multibit storage. Analysis and SPICE simulation are conducted to validate the feasibility. The proposed device does not need to join the write-checking process and can greatly promote the improvement of area, storage density, and operation speed, providing a new route for the future in-memory computing. Compared to traditional CMOS circuits used for vector multiplication, our proposed device can achieve 93.75% reduction in terms of number of devices.
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基于rram的矢量乘法和超高面积效率的多比特存储单器件
考虑到Von Neumann架构在速度和功耗方面都存在瓶颈,内存计算是一个很有前途的解决方案。内存计算需要在由存储单元组成的阵列中进行,这些存储单元可以是电阻式随机存取存储器(RRAM)。当使用rram时,可以利用其多阻状态特性来提高数据存储密度。然而,可靠性不足是RRAM的通病,单纯从原理上实现高长距离循环特性是很困难的。本文提出了一种新的基于RRAM的三维器件,该器件能够实现2位矢量乘法和多位存储。通过分析和SPICE仿真验证了该方法的可行性。该器件不需要加入写检查过程,可以极大地促进面积、存储密度和操作速度的提高,为未来的内存计算提供了新的途径。与用于矢量乘法的传统CMOS电路相比,我们提出的器件在器件数量方面可以减少93.75%。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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