{"title":"Controlled Acceleration of PCM Cells Time Drift Through On-Chip Current-Induced Annealing for AIMC Multilevel MVM Computation","authors":"Alessio Antolini;Francesco Zavalloni;Andrea Lico;Riccardo Vignali;Luca Iannelli;Riccardo Zurla;Jacopo Bertolini;Emanuela Calvetti;Marco Pasotti;Eleonora Franchi Scarselli;Alessandro Cabrini","doi":"10.1109/TED.2024.3496445","DOIUrl":null,"url":null,"abstract":"This article introduces a method to mitigate conductance time drift of phase-change memory (PCM) cells for improved resilience of matrix-vector multiplication (MVM) in analog in-memory computing (AIMC) systems. The proposed approach consists of on-chip current-induced annealing of each PCM device to stabilize its conductance at a target level, avoiding any rearrangement of the cell lattice. The procedure is performed within the programming phase of PCM devices with no severe constraints on execution time because of the infrequent update of MVM weights in deep neural networks (DNNs). Experimental validations were conducted on a 90-nm STMicroelectronics CMOS Ge-rich GeSbTe (GST)-embedded PCM targeting 16 conductance levels, and results indicate that the average time drift and variability of cells conductance are reduced by at least a factor of 2.3 and 3.5, respectively, compared with standard programming. Simulations based on empirical results reveal a 0.8% MVM accuracy loss after 12 h at room temperature and 4.8% after an additional 64-h bake at 85 ° C, with a considerable increase in MVM computing retention compared with those granted with standard programming. Accuracy loss is minimized to around 1% even at high temperatures when the proposed method is combined with hardware drift compensation.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 1","pages":"215-221"},"PeriodicalIF":2.9000,"publicationDate":"2024-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10758353/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article introduces a method to mitigate conductance time drift of phase-change memory (PCM) cells for improved resilience of matrix-vector multiplication (MVM) in analog in-memory computing (AIMC) systems. The proposed approach consists of on-chip current-induced annealing of each PCM device to stabilize its conductance at a target level, avoiding any rearrangement of the cell lattice. The procedure is performed within the programming phase of PCM devices with no severe constraints on execution time because of the infrequent update of MVM weights in deep neural networks (DNNs). Experimental validations were conducted on a 90-nm STMicroelectronics CMOS Ge-rich GeSbTe (GST)-embedded PCM targeting 16 conductance levels, and results indicate that the average time drift and variability of cells conductance are reduced by at least a factor of 2.3 and 3.5, respectively, compared with standard programming. Simulations based on empirical results reveal a 0.8% MVM accuracy loss after 12 h at room temperature and 4.8% after an additional 64-h bake at 85 ° C, with a considerable increase in MVM computing retention compared with those granted with standard programming. Accuracy loss is minimized to around 1% even at high temperatures when the proposed method is combined with hardware drift compensation.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.