Controlled Acceleration of PCM Cells Time Drift Through On-Chip Current-Induced Annealing for AIMC Multilevel MVM Computation

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-11-19 DOI:10.1109/TED.2024.3496445
Alessio Antolini;Francesco Zavalloni;Andrea Lico;Riccardo Vignali;Luca Iannelli;Riccardo Zurla;Jacopo Bertolini;Emanuela Calvetti;Marco Pasotti;Eleonora Franchi Scarselli;Alessandro Cabrini
{"title":"Controlled Acceleration of PCM Cells Time Drift Through On-Chip Current-Induced Annealing for AIMC Multilevel MVM Computation","authors":"Alessio Antolini;Francesco Zavalloni;Andrea Lico;Riccardo Vignali;Luca Iannelli;Riccardo Zurla;Jacopo Bertolini;Emanuela Calvetti;Marco Pasotti;Eleonora Franchi Scarselli;Alessandro Cabrini","doi":"10.1109/TED.2024.3496445","DOIUrl":null,"url":null,"abstract":"This article introduces a method to mitigate conductance time drift of phase-change memory (PCM) cells for improved resilience of matrix-vector multiplication (MVM) in analog in-memory computing (AIMC) systems. The proposed approach consists of on-chip current-induced annealing of each PCM device to stabilize its conductance at a target level, avoiding any rearrangement of the cell lattice. The procedure is performed within the programming phase of PCM devices with no severe constraints on execution time because of the infrequent update of MVM weights in deep neural networks (DNNs). Experimental validations were conducted on a 90-nm STMicroelectronics CMOS Ge-rich GeSbTe (GST)-embedded PCM targeting 16 conductance levels, and results indicate that the average time drift and variability of cells conductance are reduced by at least a factor of 2.3 and 3.5, respectively, compared with standard programming. Simulations based on empirical results reveal a 0.8% MVM accuracy loss after 12 h at room temperature and 4.8% after an additional 64-h bake at 85 ° C, with a considerable increase in MVM computing retention compared with those granted with standard programming. Accuracy loss is minimized to around 1% even at high temperatures when the proposed method is combined with hardware drift compensation.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 1","pages":"215-221"},"PeriodicalIF":2.9000,"publicationDate":"2024-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10758353/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

This article introduces a method to mitigate conductance time drift of phase-change memory (PCM) cells for improved resilience of matrix-vector multiplication (MVM) in analog in-memory computing (AIMC) systems. The proposed approach consists of on-chip current-induced annealing of each PCM device to stabilize its conductance at a target level, avoiding any rearrangement of the cell lattice. The procedure is performed within the programming phase of PCM devices with no severe constraints on execution time because of the infrequent update of MVM weights in deep neural networks (DNNs). Experimental validations were conducted on a 90-nm STMicroelectronics CMOS Ge-rich GeSbTe (GST)-embedded PCM targeting 16 conductance levels, and results indicate that the average time drift and variability of cells conductance are reduced by at least a factor of 2.3 and 3.5, respectively, compared with standard programming. Simulations based on empirical results reveal a 0.8% MVM accuracy loss after 12 h at room temperature and 4.8% after an additional 64-h bake at 85 ° C, with a considerable increase in MVM computing retention compared with those granted with standard programming. Accuracy loss is minimized to around 1% even at high temperatures when the proposed method is combined with hardware drift compensation.
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芯片上电流诱导退火控制PCM单元时间漂移的AIMC多电平MVM计算
本文介绍了一种缓解相变存储器(PCM)单元电导时间漂移的方法,以提高模拟内存计算(AIMC)系统中矩阵向量乘法(MVM)的弹性。所提出的方法包括每个PCM器件的片上电流诱导退火,以将其电导稳定在目标水平,避免任何晶格重排。该过程在PCM设备的编程阶段执行,由于深度神经网络(dnn)中MVM权重的不频繁更新,因此对执行时间没有严格的限制。在90 nm意法半导体CMOS富ge GeSbTe (GST)嵌入式PCM上进行了16个电导水平的实验验证,结果表明,与标准编程相比,电池电导的平均时间漂移和可变性分别减少了至少2.3和3.5倍。基于经验结果的模拟显示,在室温下12小时后,MVM精度损失为0.8%,在85°C下再烘烤64小时后,MVM精度损失为4.8%,与标准编程相比,MVM计算保留率显著提高。当该方法与硬件漂移补偿相结合时,即使在高温下,精度损失也最小到1%左右。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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