{"title":"Performance comparison between current-mode signaling and voltage-mode signaling for multilayer graphene nanoribbon (MLGNR) interconnects","authors":"Fa Zou, Zhongliang Pan, Peng Xu","doi":"10.1007/s10825-024-02274-2","DOIUrl":null,"url":null,"abstract":"<div><p>Graphene nanoribbon (GNR) is emerging as a superior material for nanometer-scale interconnects, offering superior performance compared with traditional copper materials. To date, most research on GNR interconnects has focused on voltage-mode signaling (VMS) scheme, with little study on current-mode signaling (CMS) scheme. In this paper, we propose an equivalent circuit model of two-wire coupled multilayer graphene nanoribbon (MLGNR) interconnects using VMS and CMS schemes. Moreover, the model takes into account influence of temperature effect, coupling capacitive and mutual inductive. Performance of victim wire in two-wire coupled MLGNR and Copper (Cu) interconnects using VMS and CMS signaling schemes is investigated by applying the decoupling approach and ABCD parameter matrix method at local, intermediate, and global levels, respectively. In addition, the performance of MLGNR and Cu interconnects employing VMS and CMS systems is thoroughly compared and examined in this research. The results reveal that interconnects adopting the CMS scheme have less output voltage swing, less crosstalk delay, greater 3-dB bandwidth, and better signal integrity, compared to interconnects applying the VMS scheme, under the same conditions. With respect to noise, we observe that the CMS scheme has lower noise amplitude, smaller noise peak, and smaller noise width, resulting in greater noise immunity. Moreover, it is manifested that crosstalk delay, noise width, and 3 dB bandwidth are all temperature-dependent. As the temperature rises, both the delay and noise width increase, while the bandwidth decreases. In addition, the results indicate that MLGNR interconnects exhibit lower crosstalk delay, narrower noise width, larger bandwidth, and smaller dynamic power consumption compared to Cu interconnects under the same conditions. Furthermore, we discuss performance optimization methods for interconnects using both VMS and CMS schemes. Also, it is discovered that there is great agreement between the results of HSPICE simulations and those produced by the ABCD parameter matrix technique.</p></div>","PeriodicalId":620,"journal":{"name":"Journal of Computational Electronics","volume":"24 1","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2025-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Computational Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10825-024-02274-2","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Graphene nanoribbon (GNR) is emerging as a superior material for nanometer-scale interconnects, offering superior performance compared with traditional copper materials. To date, most research on GNR interconnects has focused on voltage-mode signaling (VMS) scheme, with little study on current-mode signaling (CMS) scheme. In this paper, we propose an equivalent circuit model of two-wire coupled multilayer graphene nanoribbon (MLGNR) interconnects using VMS and CMS schemes. Moreover, the model takes into account influence of temperature effect, coupling capacitive and mutual inductive. Performance of victim wire in two-wire coupled MLGNR and Copper (Cu) interconnects using VMS and CMS signaling schemes is investigated by applying the decoupling approach and ABCD parameter matrix method at local, intermediate, and global levels, respectively. In addition, the performance of MLGNR and Cu interconnects employing VMS and CMS systems is thoroughly compared and examined in this research. The results reveal that interconnects adopting the CMS scheme have less output voltage swing, less crosstalk delay, greater 3-dB bandwidth, and better signal integrity, compared to interconnects applying the VMS scheme, under the same conditions. With respect to noise, we observe that the CMS scheme has lower noise amplitude, smaller noise peak, and smaller noise width, resulting in greater noise immunity. Moreover, it is manifested that crosstalk delay, noise width, and 3 dB bandwidth are all temperature-dependent. As the temperature rises, both the delay and noise width increase, while the bandwidth decreases. In addition, the results indicate that MLGNR interconnects exhibit lower crosstalk delay, narrower noise width, larger bandwidth, and smaller dynamic power consumption compared to Cu interconnects under the same conditions. Furthermore, we discuss performance optimization methods for interconnects using both VMS and CMS schemes. Also, it is discovered that there is great agreement between the results of HSPICE simulations and those produced by the ABCD parameter matrix technique.
期刊介绍:
he Journal of Computational Electronics brings together research on all aspects of modeling and simulation of modern electronics. This includes optical, electronic, mechanical, and quantum mechanical aspects, as well as research on the underlying mathematical algorithms and computational details. The related areas of energy conversion/storage and of molecular and biological systems, in which the thrust is on the charge transport, electronic, mechanical, and optical properties, are also covered.
In particular, we encourage manuscripts dealing with device simulation; with optical and optoelectronic systems and photonics; with energy storage (e.g. batteries, fuel cells) and harvesting (e.g. photovoltaic), with simulation of circuits, VLSI layout, logic and architecture (based on, for example, CMOS devices, quantum-cellular automata, QBITs, or single-electron transistors); with electromagnetic simulations (such as microwave electronics and components); or with molecular and biological systems. However, in all these cases, the submitted manuscripts should explicitly address the electronic properties of the relevant systems, materials, or devices and/or present novel contributions to the physical models, computational strategies, or numerical algorithms.