Scheduling Time-Constrained Cluster Tools With Non-Identical Parallel Processing Chambers

IF 6.4 2区 计算机科学 Q1 AUTOMATION & CONTROL SYSTEMS IEEE Transactions on Automation Science and Engineering Pub Date : 2025-01-09 DOI:10.1109/TASE.2025.3527479
Fajun Yang;Rui Wang;Nan Chen;Naiqi Wu;MengChu Zhou
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Abstract

As a computer-integrated manufacturing system, cluster tools are widely used for semiconductor manufacturing. To tackle their scheduling problems with parallel processing chambers, existing studies assume that the parallel processing chambers at each step are identical. However, due to machine aging, some differences among them could appear in reality. This work represents the first one to report the scheduling problems of cluster tools with non-identical parallel processing chambers. By focusing on time-constrained single and dual-armed cluster tools with non-identical parallel processing chambers, it derives the sufficient conditions under which a system is schedulable. Based on them, it develops two algorithms to obtain the feasible and optimal schedules. It also develops two linear programming models to find the feasible and optimal ones if the sufficient conditions are violated. The experimental results based on 5400 random instances show that the proposed scheduling method can be readily used to generate schedules for both time-constrained single and dual-armed cluster tools. Note to Practitioners—For cluster tools, due to machine aging, the wafer processing time at parallel processing chambers performing the same process tends to be different in practice. Such parallel processing chambers are called non-identical ones. It is tough to schedule time-constrained (with wafer residency time constraint) cluster tools with non-identical parallel processing chambers. The challenge is how to allocate robot waiting time at each step such that the wafer residency time constraint is satisfied. To ensure the high quality of finished wafers, their post-processing time at non-identical parallel processing chambers must be equal. This work offers readily applicable methods to address the problems, thereby generating a positive influence on the wafer quality and yield in the critically important field of semiconductor manufacturing.
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具有非相同并行处理室的调度时间约束集群工具
集群工具作为一种计算机集成制造系统,在半导体制造中得到了广泛的应用。为了解决并行加工室的调度问题,现有研究假设每一步的并行加工室是相同的。然而,由于机器老化,在现实中它们之间可能会出现一些差异。本文首次报道了具有非相同并行处理室的集群工具的调度问题。通过对具有非相同并行处理室的受时间约束的单臂和双臂集群工具进行研究,得出了系统可调度的充分条件。在此基础上,开发了两种算法来获得可行和最优调度。并建立了两个线性规划模型,在满足充分条件的情况下求出最优和可行的规划模型。基于5400个随机实例的实验结果表明,所提出的调度方法可以很容易地用于生成具有时间约束的单臂和双臂集群工具的调度。从业人员注意:对于集群工具,由于机器老化,在并行处理室执行相同工艺的晶圆处理时间在实践中往往不同。这种并行处理室称为非相同处理室。具有不相同并行处理室的集群工具很难调度时间约束(具有晶圆驻留时间约束)。挑战在于如何分配机器人在每一步的等待时间,以满足晶圆驻留时间约束。为了保证成品晶圆的高质量,它们在不同平行处理室的后处理时间必须相等。这项工作提供了易于应用的方法来解决这些问题,从而对半导体制造中至关重要的领域的晶圆质量和良率产生积极的影响。
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来源期刊
IEEE Transactions on Automation Science and Engineering
IEEE Transactions on Automation Science and Engineering 工程技术-自动化与控制系统
CiteScore
12.50
自引率
14.30%
发文量
404
审稿时长
3.0 months
期刊介绍: The IEEE Transactions on Automation Science and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. T-ASE welcomes results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, security, service, supply chains, and transportation. T-ASE addresses a research community willing to integrate knowledge across disciplines and industries. For this purpose, each paper includes a Note to Practitioners that summarizes how its results can be applied or how they might be extended to apply in practice.
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