Different Grain Sizes of \({\mathrm{{MgAl}}_2\mathrm{{O}}_4}\) Doped Alumina and Its Influence on SPD, CDBD, and APTD

IF 2.6 3区 物理与天体物理 Q3 ENGINEERING, CHEMICAL Plasma Chemistry and Plasma Processing Pub Date : 2024-10-27 DOI:10.1007/s11090-024-10523-2
R. Pribyl, J. Lexmaul, M. Pazderka, P. Stastny, J. Kelar
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Abstract

The paper is focused on studying magnesium spinel-doped alumina tapes and their effect on plasma. Developed tapes were made from a mixture of \(15\,\mathrm {vol.\%}\) of \(\mathrm {MgAl_2O_4}\) by the gel tape casting method. Ceramic tapes were sintered at different temperatures from \(1450\,^\circ {\textrm{C}}\) up to \(1700\,^\circ {\textrm{C}}\). The sintering temperature significantly influenced the material’s grain sizes, but the material’s chemical and phase composition was the same for all sintering temperatures. We measured the surface potential decay and showed that it is not enough to have fast surface potential decay for Atmospheric Pressure Townsend Discharge, but the homogeneity of the surface itself crucially influences the stability of Atmospheric Pressure Townsend Discharge. On the other hand, the ignition voltage of coplanar dielectric discharge was not influenced by the gran size difference.

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\({\mathrm{{MgAl}}_2\mathrm{{O}}_4}\)掺杂氧化铝的不同晶粒尺寸及其对SPD、CDBD和APTD的影响
本文主要研究了镁尖晶石掺杂氧化铝带及其对等离子体的影响。以\(15\,\mathrm {vol.\%}\)和\(\mathrm {MgAl_2O_4}\)的混合物为原料,采用胶带铸造法制成胶粘带。陶瓷带在\(1450\,^\circ {\textrm{C}}\)至\(1700\,^\circ {\textrm{C}}\)的不同温度下烧结。烧结温度对材料的晶粒尺寸有显著影响,但各烧结温度下材料的化学成分和相组成基本相同。我们对表面电位衰减进行了测量,结果表明,对于常压汤森放电来说,表面电位衰减速度快是不够的,表面本身的均匀性对常压汤森放电的稳定性有着至关重要的影响。另一方面,共面介质放电的点火电压不受颗粒尺寸差异的影响。
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来源期刊
Plasma Chemistry and Plasma Processing
Plasma Chemistry and Plasma Processing 工程技术-工程:化工
CiteScore
5.90
自引率
8.30%
发文量
73
审稿时长
6-12 weeks
期刊介绍: Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
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