Large-scale Fabrication of Less Entangled Polyamide by Direct Solid-state Polymerization and the Impact of Entanglement on Crystal Structure and Performance

IF 4.1 2区 化学 Q2 POLYMER SCIENCE Polymer Pub Date : 2025-01-18 DOI:10.1016/j.polymer.2025.128072
Xiaohuan Bu, Wei Zhao, Xin Li, Wenjie Zhang, Yuancheng Zhang, Ge Shi, Yanjie He, Zhe Cui, Peng Fu, Xinchang Pang, Hong Wu, Xiaomeng Zhang, Minying Liu
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Abstract

Polyamide 66 (PA66) with less entangled structure, high crystallinity and excellent mechanical properties was fabricated in this work by direct solid-state polymerization (DSSP) method. The polymerization process and mechanism of DSSP were systematically investigated. Results demonstrate that DSSP is a transition process from salt crystal directly to polymer crystal, enabling the production of PA66 with a less entangled and highly crystalline structure. DSSP sample exhibits a crystallinity of 51.8% as tested by WAXD, and 59.7% when measured via DSC, surpassing the crystallinity of the majority of PA66 fibers. Furthermore, the sample achieves a maximum melting point of 271.7 °C. Correspondingly, mechanical properties and heat distortion temperature of DSSP sample are also improved. Therefore, this work enhances the in-depth understanding of polymerization mechanism of DSSP, and provides an efficient, scalable approach for fabricating polymers with less entanglement, high crystallinity, and exceptional performance characteristics.

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直接固态聚合大规模制备少纠缠聚酰胺及其对晶体结构和性能的影响
采用直接固相聚合(DSSP)法制备了结构纠缠少、结晶度高、力学性能优良的聚酰胺66 (PA66)。系统地研究了DSSP的聚合过程和机理。结果表明,DSSP是一个由盐晶直接向聚合物晶过渡的过程,使PA66具有较少纠缠和高结晶结构。通过WAXD测试,DSSP样品的结晶度为51.8%,通过DSC测试,其结晶度为59.7%,超过了大多数PA66纤维的结晶度。此外,样品的最大熔点达到271.7°C。相应的,DSSP样品的力学性能和热变形温度也得到了改善。因此,本研究增强了对DSSP聚合机理的深入理解,为制备缠结少、结晶度高、性能优异的聚合物提供了一种高效、可扩展的方法。
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来源期刊
Polymer
Polymer 化学-高分子科学
CiteScore
7.90
自引率
8.70%
发文量
959
审稿时长
32 days
期刊介绍: Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics. The main scope is covered but not limited to the following core areas: Polymer Materials Nanocomposites and hybrid nanomaterials Polymer blends, films, fibres, networks and porous materials Physical Characterization Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films Polymer Engineering Advanced multiscale processing methods Polymer Synthesis, Modification and Self-assembly Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization Technological Applications Polymers for energy generation and storage Polymer membranes for separation technology Polymers for opto- and microelectronics.
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