{"title":"Simultaneous Enhancement of Strength and Ductility of Cu2-xSe through Dual-Phase Heterostructure","authors":"Chenyang Xiao, Luoqi Wu, Kailiang Fang, Zhuoming Xia, Nianchu Jiang, Bo Duan, Xiaobin Feng, Ling Zhou, Pengcheng Zhai, Guodong Li, Qingjie Zhang","doi":"10.1016/j.actamat.2025.120761","DOIUrl":null,"url":null,"abstract":"High-performance thermoelectric (TE) materials usually exhibit brittleness and poor ductility, which limits their device fabrication and applications in flexible and deformable electronics. In this work, we propose a dual-phase heterostructure strategy to simultaneously improve the strength and ductility of Cu<sub>2-</sub><em><sub>x</sub></em>Se TE materials. We used solid-state sintering to obtain a coexisted Cu<sub>2-</sub><em><sub>x</sub></em>Se structure with a hard <em>α</em>-phase (space group of C2/c, poor ductility, and high yield strength) and a soft <em>β-</em>phase (space group of <em>Fm</em>-3<em>m</em>, superior ductility, and lower yield strength). Owing to the large strain hardening of the <em>β-</em>phase and the back stress strengthening effect of the heterostructure, the fracture strain, yield strength, and compressive strength of the heterostructured Cu<sub>1.88</sub>Se material were simultaneously improved by 266%, 16%, and 44%, respectively, compared to the homogeneous Cu<sub>1.93</sub>Se material. This study proposes an effective dual-phase heterostructure strategy for synergistically enhancing the strength and ductility of intrinsically brittle TE semiconductor materials.","PeriodicalId":238,"journal":{"name":"Acta Materialia","volume":"28 1","pages":""},"PeriodicalIF":8.3000,"publicationDate":"2025-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Materialia","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.actamat.2025.120761","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
High-performance thermoelectric (TE) materials usually exhibit brittleness and poor ductility, which limits their device fabrication and applications in flexible and deformable electronics. In this work, we propose a dual-phase heterostructure strategy to simultaneously improve the strength and ductility of Cu2-xSe TE materials. We used solid-state sintering to obtain a coexisted Cu2-xSe structure with a hard α-phase (space group of C2/c, poor ductility, and high yield strength) and a soft β-phase (space group of Fm-3m, superior ductility, and lower yield strength). Owing to the large strain hardening of the β-phase and the back stress strengthening effect of the heterostructure, the fracture strain, yield strength, and compressive strength of the heterostructured Cu1.88Se material were simultaneously improved by 266%, 16%, and 44%, respectively, compared to the homogeneous Cu1.93Se material. This study proposes an effective dual-phase heterostructure strategy for synergistically enhancing the strength and ductility of intrinsically brittle TE semiconductor materials.
期刊介绍:
Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.