Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2025-01-22 DOI:10.1038/s41528-024-00378-0
Dong Hyeon Lee, Younghoon Park, Yoon Seo, Hannah Noh, Hyunbeen Jeong, Jongmo Seo, Min-Ho Seo, Kyungsik Eom, Joonsoo Jeong
{"title":"Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces","authors":"Dong Hyeon Lee, Younghoon Park, Yoon Seo, Hannah Noh, Hyunbeen Jeong, Jongmo Seo, Min-Ho Seo, Kyungsik Eom, Joonsoo Jeong","doi":"10.1038/s41528-024-00378-0","DOIUrl":null,"url":null,"abstract":"<p>Increasing the proximity of microelectrode arrays (MEA) to targeted neural tissues can establish efficient neural interfaces for both recording and stimulation applications. This has been achieved by constructing protruding three-dimensional (3D) structures on top of conventional planar microelectrodes via additional micromachining steps. However, this approach adds fabrication complexities and limits the 3D structures to certain shapes. We propose a one-step fabrication of MEAs with versatile microscopic 3D structures via “microelectrothermoforming (μETF)” of thermoplastics, by utilizing 3D-printed molds to locally deform planar MEAs into protruding and recessing shapes. Electromechanical optimization enabled a 3D MEA with 80 μm protrusions and/or recession for 100 μm diameter. Its simple and versatile shaping capabilities are demonstrated by diverse 3D structures on a single MEA. The benefits of 3D MEA are evaluated in retinal stimulation through numerical simulations and ex vivo experiments, confirming a threshold lowered by 1.7 times and spatial resolution enhanced by 2.2 times.</p>","PeriodicalId":48528,"journal":{"name":"npj Flexible Electronics","volume":"103 1","pages":""},"PeriodicalIF":12.3000,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"npj Flexible Electronics","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1038/s41528-024-00378-0","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

Increasing the proximity of microelectrode arrays (MEA) to targeted neural tissues can establish efficient neural interfaces for both recording and stimulation applications. This has been achieved by constructing protruding three-dimensional (3D) structures on top of conventional planar microelectrodes via additional micromachining steps. However, this approach adds fabrication complexities and limits the 3D structures to certain shapes. We propose a one-step fabrication of MEAs with versatile microscopic 3D structures via “microelectrothermoforming (μETF)” of thermoplastics, by utilizing 3D-printed molds to locally deform planar MEAs into protruding and recessing shapes. Electromechanical optimization enabled a 3D MEA with 80 μm protrusions and/or recession for 100 μm diameter. Its simple and versatile shaping capabilities are demonstrated by diverse 3D structures on a single MEA. The benefits of 3D MEA are evaluated in retinal stimulation through numerical simulations and ex vivo experiments, confirming a threshold lowered by 1.7 times and spatial resolution enhanced by 2.2 times.

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微电热成形(μETF):用于增强神经接口的柔性微电子一步通用3D成形
增加微电极阵列(MEA)与目标神经组织的接近度可以为记录和刺激应用建立有效的神经接口。这是通过在传统的平面微电极上通过额外的微加工步骤构建突出的三维(3D)结构来实现的。然而,这种方法增加了制造的复杂性,并将3D结构限制在某些形状。我们提出了一种通过热塑性塑料的“微电热成形(μETF)”一步制造具有多种微观三维结构的mea,利用3D打印模具将平面mea局部变形成突出和凹陷的形状。机电优化使3D MEA具有80 μm的凸起和/或100 μm直径的凹陷。其简单和通用的塑造能力是由不同的3D结构在一个单一的MEA证明。通过数值模拟和离体实验评估了3D MEA在视网膜刺激中的优势,确认阈值降低了1.7倍,空间分辨率提高了2.2倍。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
期刊最新文献
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