{"title":"Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)","authors":"Patrick R. Bressler, Michael Töpper, Peter Ramm","doi":"10.1038/s44287-024-00134-6","DOIUrl":null,"url":null,"abstract":"The European Chips Act of 2022 calls for European microelectronics pilot lines to develop and validate novel design and fabrication technologies for next-generation microelectronic chips. Fundamental for new electronic components and systems, advanced packaging and heterogeneous integration technologies are the focus of the APECS pilot line.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 1","pages":"4-5"},"PeriodicalIF":0.0000,"publicationDate":"2025-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-024-00134-6","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The European Chips Act of 2022 calls for European microelectronics pilot lines to develop and validate novel design and fabrication technologies for next-generation microelectronic chips. Fundamental for new electronic components and systems, advanced packaging and heterogeneous integration technologies are the focus of the APECS pilot line.
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