Pub Date : 2026-01-07DOI: 10.1038/s44287-025-00257-4
Rachel Won
A study in Nature Photonics reports a miniaturized cascaded-diode-array spectral imager that enables electrically tunable spectral measurements from 365 nm down to 250 nm.
{"title":"Compact UV spectral imager","authors":"Rachel Won","doi":"10.1038/s44287-025-00257-4","DOIUrl":"10.1038/s44287-025-00257-4","url":null,"abstract":"A study in Nature Photonics reports a miniaturized cascaded-diode-array spectral imager that enables electrically tunable spectral measurements from 365 nm down to 250 nm.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"9-9"},"PeriodicalIF":0.0,"publicationDate":"2026-01-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-07DOI: 10.1038/s44287-025-00259-2
This year brings fresh perspectives to our editorial team, alongside a renewed focus on delivering authoritative insights and fostering collaboration. Together, let’s make 2026 a year of innovation, dialogue and transformative breakthroughs.
{"title":"New phase, new faces, same mission","authors":"","doi":"10.1038/s44287-025-00259-2","DOIUrl":"10.1038/s44287-025-00259-2","url":null,"abstract":"This year brings fresh perspectives to our editorial team, alongside a renewed focus on delivering authoritative insights and fostering collaboration. Together, let’s make 2026 a year of innovation, dialogue and transformative breakthroughs.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2026-01-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.comhttps://www.nature.com/articles/s44287-025-00259-2.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-02DOI: 10.1038/s44287-025-00227-w
Yuxin Zhao
China’s microelectromechanical systems (MEMS) sensor industry is surging, but technical gaps, fragmented production and coordination challenges hinder its full potential. As global demand accelerates, it is important to consolidate this sector and forge greater independence in innovation to enhance China’s global competitiveness in the field.
{"title":"Path to global microelectromechanical sensor industry competitiveness","authors":"Yuxin Zhao","doi":"10.1038/s44287-025-00227-w","DOIUrl":"10.1038/s44287-025-00227-w","url":null,"abstract":"China’s microelectromechanical systems (MEMS) sensor industry is surging, but technical gaps, fragmented production and coordination challenges hinder its full potential. As global demand accelerates, it is important to consolidate this sector and forge greater independence in innovation to enhance China’s global competitiveness in the field.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"2-4"},"PeriodicalIF":0.0,"publicationDate":"2026-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-02DOI: 10.1038/s44287-025-00252-9
Miranda L. Vinay
Researchers introduce the FoRoGated-Structure, a folding and rolling structure that combines compact storage with strength. This structure supports sliding and load bearing, enabling robots with extended reach and structural stability demonstrated through a vacuum-inspired reaching robot and a gantry structure.
{"title":"Rolling and folding deployable robotics","authors":"Miranda L. Vinay","doi":"10.1038/s44287-025-00252-9","DOIUrl":"10.1038/s44287-025-00252-9","url":null,"abstract":"Researchers introduce the FoRoGated-Structure, a folding and rolling structure that combines compact storage with strength. This structure supports sliding and load bearing, enabling robots with extended reach and structural stability demonstrated through a vacuum-inspired reaching robot and a gantry structure.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"7-7"},"PeriodicalIF":0.0,"publicationDate":"2026-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-02DOI: 10.1038/s44287-025-00255-6
Jiahao Liu
A study in Nature Energy reports a software-based approach that allows AI data centres to operate as flexible, grid-aware loads, reducing power demand during peak periods without compromising performance.
{"title":"AI data centres step up as flexible grid assets","authors":"Jiahao Liu","doi":"10.1038/s44287-025-00255-6","DOIUrl":"10.1038/s44287-025-00255-6","url":null,"abstract":"A study in Nature Energy reports a software-based approach that allows AI data centres to operate as flexible, grid-aware loads, reducing power demand during peak periods without compromising performance.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"8-8"},"PeriodicalIF":0.0,"publicationDate":"2026-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-02DOI: 10.1038/s44287-025-00249-4
Shaofeng Hu, Rachel Won
Shaofeng Hu, director of the Division of Science Policy and Basic Sciences at UNESCO’s Natural Sciences Sector, speaks to Nature Reviews Electrical Engineering about the objectives, expected outcomes and global impact of UNESCO’s International Decade of Sciences for Sustainable Development. Shaofeng Hu speaks about the objectives, expected outcomes and global impact of UNESCO’s International Decade of Sciences for Sustainable Development.
{"title":"Science decade for sustainable development","authors":"Shaofeng Hu, Rachel Won","doi":"10.1038/s44287-025-00249-4","DOIUrl":"10.1038/s44287-025-00249-4","url":null,"abstract":"Shaofeng Hu, director of the Division of Science Policy and Basic Sciences at UNESCO’s Natural Sciences Sector, speaks to Nature Reviews Electrical Engineering about the objectives, expected outcomes and global impact of UNESCO’s International Decade of Sciences for Sustainable Development. Shaofeng Hu speaks about the objectives, expected outcomes and global impact of UNESCO’s International Decade of Sciences for Sustainable Development.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"5-6"},"PeriodicalIF":0.0,"publicationDate":"2026-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970208","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-10DOI: 10.1038/s44287-025-00245-8
This year’s quantum celebrations and triumphs have sparked global excitement. Now it’s time to turn that momentum into lasting action to build an inclusive global quantum community.
{"title":"Bridging the quantum divide","authors":"","doi":"10.1038/s44287-025-00245-8","DOIUrl":"10.1038/s44287-025-00245-8","url":null,"abstract":"This year’s quantum celebrations and triumphs have sparked global excitement. Now it’s time to turn that momentum into lasting action to build an inclusive global quantum community.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 12","pages":"789-789"},"PeriodicalIF":0.0,"publicationDate":"2025-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.comhttps://www.nature.com/articles/s44287-025-00245-8.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145719850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-28DOI: 10.1038/s44287-025-00248-5
Rachel Won
The 1st International Conference on Superconductor Materials and Metamaterials for Quantum Hardware was held in Glasgow, UK, on 18–19 November. Here, we present a summary of the inaugural conference.
{"title":"The 1st International Conference on Superconductor Materials and Metamaterials for Quantum Hardware (SM2Q-2025)","authors":"Rachel Won","doi":"10.1038/s44287-025-00248-5","DOIUrl":"10.1038/s44287-025-00248-5","url":null,"abstract":"The 1st International Conference on Superconductor Materials and Metamaterials for Quantum Hardware was held in Glasgow, UK, on 18–19 November. Here, we present a summary of the inaugural conference.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 12","pages":"796-796"},"PeriodicalIF":0.0,"publicationDate":"2025-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145719846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-27DOI: 10.1038/s44287-025-00231-0
Hao Huang, Xiaonan Chen, Jing Bai, Dingyao Liu, Björn Lüssem, George G. Malliaras, Shiming Zhang
Solid-state silicon transistors have profoundly transformed modern life by enabling a wide array of electronic technologies. The rise of bioelectronics has emphasized the necessity for interfacing transistors with living systems. However, challenges such as mechanical incompatibility, disparities in charge carrier types and differences in form factors present significant barriers to seamless integration. Recent advances in hydrogels have led to the development of hydrogel transistors, which merge the unique properties of hydrogels with transistor functionality, offering a solution to overcome these mismatches. This Perspective highlights hydrogel transistors, their biomimetic features and methods for their fabrication and characterization. We envision how hydrogel transistors, by evolving from conventional 2D thin-film electronics to 3D gel electronics, expand the device toolbox, enabling next-generation 3D, programmable and living bioelectronics. Transistors, the foundation of modern electronics, are typically rigid, planar and 2D, which limits their integration with soft, irregular, 3D biological systems. This Perspective highlights the rise of hydrogel transistors in overcoming these challenges and how they provide an unprecedented opportunity for next-generation 3D, programmable and living bioelectronics.
{"title":"The rise of hydrogel transistors","authors":"Hao Huang, Xiaonan Chen, Jing Bai, Dingyao Liu, Björn Lüssem, George G. Malliaras, Shiming Zhang","doi":"10.1038/s44287-025-00231-0","DOIUrl":"10.1038/s44287-025-00231-0","url":null,"abstract":"Solid-state silicon transistors have profoundly transformed modern life by enabling a wide array of electronic technologies. The rise of bioelectronics has emphasized the necessity for interfacing transistors with living systems. However, challenges such as mechanical incompatibility, disparities in charge carrier types and differences in form factors present significant barriers to seamless integration. Recent advances in hydrogels have led to the development of hydrogel transistors, which merge the unique properties of hydrogels with transistor functionality, offering a solution to overcome these mismatches. This Perspective highlights hydrogel transistors, their biomimetic features and methods for their fabrication and characterization. We envision how hydrogel transistors, by evolving from conventional 2D thin-film electronics to 3D gel electronics, expand the device toolbox, enabling next-generation 3D, programmable and living bioelectronics. Transistors, the foundation of modern electronics, are typically rigid, planar and 2D, which limits their integration with soft, irregular, 3D biological systems. This Perspective highlights the rise of hydrogel transistors in overcoming these challenges and how they provide an unprecedented opportunity for next-generation 3D, programmable and living bioelectronics.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 1","pages":"61-73"},"PeriodicalIF":0.0,"publicationDate":"2025-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145970215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-24DOI: 10.1038/s44287-025-00233-y
Hyeongjoon Kim, Sehun Oh, Sihyeon An, Jaewon Kim, Taehoon Kim, Seohyun Jeong, Onurcan Kaya, Thomas Galvani, Stephan Roche, Judy J. Cha, Manish Chhowalla, Hyeon Suk Shin, Hyeon-Jin Shin
As semiconductor-based electronic technologies continue downscaling, there is an urgent need to overcome the limitations of interconnect architectures and materials that are driving an unsustainable increase in energy consumption and jeopardizing performance. In this Review, we investigate the primary causes of prolonged signal delays in interconnect systems, providing an overview of the development of key interconnect components: metals, diffusion barriers and intermetal dielectrics. We define the essential requirements and technological hurdles for next-generation materials to be industrialized within damascene processes, including topological semi-metals such as molybdenum phosphide (MoP) and 2D materials such as graphene and amorphous boron nitride (a-BN). Integrating new materials into advanced device systems offers opportunities for the advancement of interconnect technologies and highly integrated semiconductor devices. Interconnect architectures are vital frameworks that allow disparate components, such as cores and memory, to communicate. This Review provides an overview of the development of key interconnect components, such as metals, diffusion barriers and intermetal dielectrics, and how they can offer more efficient and sustainable performance.
{"title":"Future interconnect materials for highly integrated semiconductor devices","authors":"Hyeongjoon Kim, Sehun Oh, Sihyeon An, Jaewon Kim, Taehoon Kim, Seohyun Jeong, Onurcan Kaya, Thomas Galvani, Stephan Roche, Judy J. Cha, Manish Chhowalla, Hyeon Suk Shin, Hyeon-Jin Shin","doi":"10.1038/s44287-025-00233-y","DOIUrl":"10.1038/s44287-025-00233-y","url":null,"abstract":"As semiconductor-based electronic technologies continue downscaling, there is an urgent need to overcome the limitations of interconnect architectures and materials that are driving an unsustainable increase in energy consumption and jeopardizing performance. In this Review, we investigate the primary causes of prolonged signal delays in interconnect systems, providing an overview of the development of key interconnect components: metals, diffusion barriers and intermetal dielectrics. We define the essential requirements and technological hurdles for next-generation materials to be industrialized within damascene processes, including topological semi-metals such as molybdenum phosphide (MoP) and 2D materials such as graphene and amorphous boron nitride (a-BN). Integrating new materials into advanced device systems offers opportunities for the advancement of interconnect technologies and highly integrated semiconductor devices. Interconnect architectures are vital frameworks that allow disparate components, such as cores and memory, to communicate. This Review provides an overview of the development of key interconnect components, such as metals, diffusion barriers and intermetal dielectrics, and how they can offer more efficient and sustainable performance.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 12","pages":"835-845"},"PeriodicalIF":0.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145719843","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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