Laminated Cores in Inductive Power Transfer: A Viaduct Structure for Balanced Flux and Minimal Shielding Loss

IF 6.5 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Power Electronics Pub Date : 2025-01-23 DOI:10.1109/TPEL.2025.3533697
Yibo Wang;C. Q. Jiang;Xiaosheng Wang;Liping Mo;Weisheng Guo;Teng Long
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Abstract

This letter introduces an innovative laminated core structure for high-power inductive power transfer applications using Fe-based nanocrystalline materials. While these materials offer excellent core loss performance, traditional laminated cores often suffer from uneven flux density distribution. In addition, lamination gaps can increase leakage flux and shielding loss. To address these issues, we propose a viaduct lamination core structure inspired by viaduct bridges. This design employs horizontally laminated cores as the main flux conductors and vertically laminated cores as flux balancers. Finite-element method simulations demonstrate improved flux density and loss distribution, eliminating edge flux concentration. The design achieves a quasi-isotropic flux density distribution through anisotropic combinations. Experiments with up to 22-kW output power confirm the design's effectiveness, achieving a peak ac–ac efficiency of 97.4% and eliminating edge hot spots by a temperature reduction of over 35 °C. Shielding loss is nearly reduced to zero.
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感应功率传输中的层压磁芯:平衡磁通和最小屏蔽损耗的高架桥结构
这封信介绍了一种创新的层压核心结构,用于使用铁基纳米晶体材料的大功率感应功率传输应用。虽然这些材料具有优异的磁芯损耗性能,但传统的层压磁芯往往存在磁通密度分布不均匀的问题。此外,层合间隙会增加漏磁和屏蔽损失。为了解决这些问题,我们提出了一种受高架桥启发的高架桥夹层核心结构。本设计采用水平层压铁芯作为主磁通导体,垂直层压铁芯作为磁通平衡器。有限元模拟表明,改善了磁通密度和损耗分布,消除了边缘磁通集中。设计通过各向异性组合实现了准各向同性的磁通密度分布。高达22 kw输出功率的实验证实了该设计的有效性,实现了97.4%的峰值ac-ac效率,并通过降低35°C以上的温度消除了边缘热点。屏蔽损耗几乎为零。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Power Electronics
IEEE Transactions on Power Electronics 工程技术-工程:电子与电气
CiteScore
15.20
自引率
20.90%
发文量
1099
审稿时长
3 months
期刊介绍: The IEEE Transactions on Power Electronics journal covers all issues of widespread or generic interest to engineers who work in the field of power electronics. The Journal editors will enforce standards and a review policy equivalent to the IEEE Transactions, and only papers of high technical quality will be accepted. Papers which treat new and novel device, circuit or system issues which are of generic interest to power electronics engineers are published. Papers which are not within the scope of this Journal will be forwarded to the appropriate IEEE Journal or Transactions editors. Examples of papers which would be more appropriately published in other Journals or Transactions include: 1) Papers describing semiconductor or electron device physics. These papers would be more appropriate for the IEEE Transactions on Electron Devices. 2) Papers describing applications in specific areas: e.g., industry, instrumentation, utility power systems, aerospace, industrial electronics, etc. These papers would be more appropriate for the Transactions of the Society which is concerned with these applications. 3) Papers describing magnetic materials and magnetic device physics. These papers would be more appropriate for the IEEE Transactions on Magnetics. 4) Papers on machine theory. These papers would be more appropriate for the IEEE Transactions on Power Systems. While original papers of significant technical content will comprise the major portion of the Journal, tutorial papers and papers of historical value are also reviewed for publication.
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