Shape Memory Vitrimer for Reversible Dry Adhesion Enabled by Multiscale Reprocessing and Shape Fixing

IF 8.7 1区化学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY ACS Materials Letters Pub Date : 2024-12-26 DOI:10.1021/acsmaterialslett.4c02357

Agha Aamir Jan, Junhyung Kim, Uhyeon Kim, Seungbeom Kim and Seok Kim*,

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Abstract

Existing shape memory polymer based dry adhesives lack the ability to be reprocessed and thus to form multiple permanent shapes, limiting their adaptability to various arbitrary surfaces. Here, we present a shape memory vitrimer (SMV) based reversible dry adhesive that is reprocessable, relying on transesterification. The SMV possesses a glass transition temperature (T_g) of ∼50 °C and a topology freezing transition temperature (T_v) of ∼100 °C and exhibits a significant drop in storage modulus across T_g and stress relaxation above T_v. Combined with surface microstructuring, these characteristics provide our SMV dry adhesive with excellent adhesion strength (∼1.75 MPa) and reversibility (∼1000) due to the shape memory effect. Such an outstanding adhesive capability is further highlighted by reprocessing the SMV dry adhesive, thus reforming its permanent shape to adapt to an arbitrary adherend shape. Moreover, the SMV can self-weld above T_v, enabling easy repairs and enhancing its versatility for dry adhesive applications.

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通过多尺度再加工和形状固定实现可逆干粘的形状记忆玻璃体

现有的基于形状记忆聚合物的干式粘合剂缺乏再加工的能力，因此无法形成多种永久形状，限制了它们对各种任意表面的适应性。在这里，我们提出了一种基于形状记忆玻璃体（SMV）的可逆干胶，它是可再加工的，依赖于酯交换。SMV的玻璃化转变温度（Tg）为~ 50°C，拓扑冻结转变温度（Tv）为~ 100°C，并且在Tg和Tv以上表现出显著的存储模量下降和应力松弛。结合表面微结构，由于形状记忆效应，这些特性为我们的SMV干胶提供了优异的粘附强度（~ 1.75 MPa）和可逆性（~ 1000）。通过对SMV干胶进行再加工，从而改变其永久形状以适应任意粘附形状，进一步突出了这种出色的粘附能力。此外，SMV可以在Tv上自焊接，易于维修，并增强了干胶应用的通用性。

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来源期刊

ACS Materials Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

14.60

自引率

3.50%

发文量

261

期刊介绍： ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.