Agha Aamir Jan, Junhyung Kim, Uhyeon Kim, Seungbeom Kim and Seok Kim*,
{"title":"Shape Memory Vitrimer for Reversible Dry Adhesion Enabled by Multiscale Reprocessing and Shape Fixing","authors":"Agha Aamir Jan, Junhyung Kim, Uhyeon Kim, Seungbeom Kim and Seok Kim*, ","doi":"10.1021/acsmaterialslett.4c0235710.1021/acsmaterialslett.4c02357","DOIUrl":null,"url":null,"abstract":"<p >Existing shape memory polymer based dry adhesives lack the ability to be reprocessed and thus to form multiple permanent shapes, limiting their adaptability to various arbitrary surfaces. Here, we present a shape memory vitrimer (SMV) based reversible dry adhesive that is reprocessable, relying on transesterification. The SMV possesses a glass transition temperature (<i>T</i><sub>g</sub>) of ∼50 °C and a topology freezing transition temperature (<i>T</i><sub>v</sub>) of ∼100 °C and exhibits a significant drop in storage modulus across <i>T</i><sub>g</sub> and stress relaxation above <i>T</i><sub>v</sub>. Combined with surface microstructuring, these characteristics provide our SMV dry adhesive with excellent adhesion strength (∼1.75 MPa) and reversibility (∼1000) due to the shape memory effect. Such an outstanding adhesive capability is further highlighted by reprocessing the SMV dry adhesive, thus reforming its permanent shape to adapt to an arbitrary adherend shape. Moreover, the SMV can self-weld above <i>T</i><sub>v</sub>, enabling easy repairs and enhancing its versatility for dry adhesive applications.</p>","PeriodicalId":19,"journal":{"name":"ACS Materials Letters","volume":"7 2","pages":"385–392 385–392"},"PeriodicalIF":9.6000,"publicationDate":"2024-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Materials Letters","FirstCategoryId":"92","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acsmaterialslett.4c02357","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Existing shape memory polymer based dry adhesives lack the ability to be reprocessed and thus to form multiple permanent shapes, limiting their adaptability to various arbitrary surfaces. Here, we present a shape memory vitrimer (SMV) based reversible dry adhesive that is reprocessable, relying on transesterification. The SMV possesses a glass transition temperature (Tg) of ∼50 °C and a topology freezing transition temperature (Tv) of ∼100 °C and exhibits a significant drop in storage modulus across Tg and stress relaxation above Tv. Combined with surface microstructuring, these characteristics provide our SMV dry adhesive with excellent adhesion strength (∼1.75 MPa) and reversibility (∼1000) due to the shape memory effect. Such an outstanding adhesive capability is further highlighted by reprocessing the SMV dry adhesive, thus reforming its permanent shape to adapt to an arbitrary adherend shape. Moreover, the SMV can self-weld above Tv, enabling easy repairs and enhancing its versatility for dry adhesive applications.
期刊介绍:
ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.