Lucas Nyssens;M. Nabet;M. Rack;Y. Bendou;S. Wane;J. B. Sombrin;J.-P. Raskin;D. Lederer
{"title":"Analysis of Back-Gate Bias Control on EVM Measurements of a Dual-Band Power Amplifier in 22 nm FD-SOI for 5G 28 and 39 GHz Applications","authors":"Lucas Nyssens;M. Nabet;M. Rack;Y. Bendou;S. Wane;J. B. Sombrin;J.-P. Raskin;D. Lederer","doi":"10.1109/TCSI.2024.3487636","DOIUrl":null,"url":null,"abstract":"This paper presents a dual-band power amplifier (PA) covering the 5G n257 to n260 frequency 2 bands (24.25 to 29.5 GHz and 37 to 43.5 GHz), fabricated in the 22 nm fully-depleted silicon-on-insulator (FD-SOI) CMOS technology. Its design is based on a distributed balun at the output that efficiently performs a wideband load impedance transformation. The back-gate terminal of each transistor is connected to different pads for detailed back-gate bias variation analysis. Under 5G new radio (NR) modulated signal measurements, we show how the average output power and efficiency can be optimized by varying the back-gate bias, which optimal value depends on (i) the signal bandwidth, (ii) the carrier frequency and (iii) the target error-vector-magnitude (EVM) value. To the best of the authors’ knowledge, the impact of back-gate bias control on the system-level EVM figure of merit is shown for the first time in this work. Overall, with 7.5 dBm and 7.3% mean output power and efficiency, respectively, at 27 GHz, 6 dBm and 5% at 40 GHz, for a 800 MHz bandwidth 5G NR signal, the presented PA shows outstanding performance among wideband/multiband FD-SOI-based PAs covering the 28 and 39 GHz bands, featuring comparable performance to best-in-class narrowband PA designs in FD-SOI technology.","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 2","pages":"753-762"},"PeriodicalIF":5.2000,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Circuits and Systems I: Regular Papers","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10765124/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a dual-band power amplifier (PA) covering the 5G n257 to n260 frequency 2 bands (24.25 to 29.5 GHz and 37 to 43.5 GHz), fabricated in the 22 nm fully-depleted silicon-on-insulator (FD-SOI) CMOS technology. Its design is based on a distributed balun at the output that efficiently performs a wideband load impedance transformation. The back-gate terminal of each transistor is connected to different pads for detailed back-gate bias variation analysis. Under 5G new radio (NR) modulated signal measurements, we show how the average output power and efficiency can be optimized by varying the back-gate bias, which optimal value depends on (i) the signal bandwidth, (ii) the carrier frequency and (iii) the target error-vector-magnitude (EVM) value. To the best of the authors’ knowledge, the impact of back-gate bias control on the system-level EVM figure of merit is shown for the first time in this work. Overall, with 7.5 dBm and 7.3% mean output power and efficiency, respectively, at 27 GHz, 6 dBm and 5% at 40 GHz, for a 800 MHz bandwidth 5G NR signal, the presented PA shows outstanding performance among wideband/multiband FD-SOI-based PAs covering the 28 and 39 GHz bands, featuring comparable performance to best-in-class narrowband PA designs in FD-SOI technology.
期刊介绍:
TCAS I publishes regular papers in the field specified by the theory, analysis, design, and practical implementations of circuits, and the application of circuit techniques to systems and to signal processing. Included is the whole spectrum from basic scientific theory to industrial applications. The field of interest covered includes: - Circuits: Analog, Digital and Mixed Signal Circuits and Systems - Nonlinear Circuits and Systems, Integrated Sensors, MEMS and Systems on Chip, Nanoscale Circuits and Systems, Optoelectronic - Circuits and Systems, Power Electronics and Systems - Software for Analog-and-Logic Circuits and Systems - Control aspects of Circuits and Systems.