Examination of Temperature-Dependent Polarization Switching Characteristics in Ferroelectric Ga-Doped HfO₂ Thin Films

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-15 DOI:10.1109/TED.2024.3521920
Yu-Chun Li;Xiao-Xi Li;Zi-Ying Huang;Ming Li;Ru Huang;David Wei Zhang;Hong-Liang Lu
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Abstract

The ferroelectric properties, polarization switching kinetics, and endurance characteristics of Ga-doped HfO2(Ga-HfO2) capacitors have been systematically investigated across a temperature range of 300–473 K. The results reveal a strong temperature dependence: remanent polarization ( ${P}_{\text {r}}$ ) increases, coercive voltage decreases, the imprint effect intensifies, polarization switching slows, and endurance degrades with rising temperature. Notably, the Ga-HfO2 device still maintains stable ferroelectricity at 473 K, with a $2{P}_{\text {r}}$ of $44~\mu $ C/cm2. Besides, over 80% polarization reversal can be achieved with 3.2-V/500-ns excitation for $10^{{4}}$ - $\mu $ m2 Ga-HfO2 devices. Moreover, the endurance properties of Ga-HfO2 devices surpass 2x ${10}^{{5}}$ cycles at 3.0 V/100 kHz, outperforming those of Zr-doped counterparts at 473 K. The study suggests that defect behaviors primarily drive the temperature dependence in HfO2 devices, providing valuable insights for reliable ferroelectric memory.
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掺ga铁电HfO 2薄膜温度相关极化开关特性的研究
在300-473 K的温度范围内,系统地研究了掺Ga-HfO2 (Ga-HfO2)电容器的铁电特性、极化开关动力学和续航特性。结果表明:随着温度的升高,残余极化(${P}_{\text {r}}$)增加,强制电压降低,压印效应增强,极化开关变慢,续航时间降低。值得注意的是,Ga-HfO2器件在473 K下仍然保持稳定的铁电性,其$2{P}_{\text {r}}$为$44~\mu $ C/cm2。此外,对于$10^{{4}}$ - $\mu $ m2的Ga-HfO2器件,在3.2 v /500-ns激励下可实现80%以上的极化反转。此外,Ga-HfO2器件在3.0 V/100 kHz下的续航性能超过2倍${10}^{{5}}$周期,优于掺杂zr器件在473 K下的续航性能。该研究表明,缺陷行为主要驱动HfO2器件的温度依赖性,为可靠的铁电存储器提供了有价值的见解。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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