Two-dimensional modeling of thermoelastic damping in small-sized circular plates with size-dependent behavior in both mechanical and thermal areas

IF 4.4 3区 工程技术 Q1 ENGINEERING, CIVIL Archives of Civil and Mechanical Engineering Pub Date : 2025-01-29 DOI:10.1007/s43452-025-01134-5
Vahid Borjalilou, Mohsen Asghari, Shahab Esmaeili, Ali Mohammad Baghestani
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Abstract

Within the realm of micro/nanomechanics, thermoelastic damping (TED) is acknowledged as a contributing factor to energy dissipation in mechanical structures. Consequently, the development of an accurate model for this phenomenon is crucial to get the best performance out of extremely small resonators. Considering the superiority of multi-dimensional heat transfer modeling compared to one-dimensional (1D) modeling as well as the definiteness of the size effect on both mechanical and thermal fields, this paper establishes a mathematical framework to appraise TED in circular micro/nanoplates with two-dimensional (2D) heat conduction by leveraging the capabilities of the modified couple stress theory (MCST) and Moore–Gibson–Thompson (MGT) heat equation. To initiate the investigation, the constitutive and heat equations for circular plates are formulated based on the MCST and MGT model. Through the solution of 2D heat equation, the spatial distribution of temperature within the plate is determined. Employing the previously obtained couple stress-based constitutive equations and temperature distribution function, the mathematical expressions of wasted and elastic energies within a single vibration cycle are derived. Ultimately, the substitution of the derived expressions into the formula of energy dissipation (ED) approach yields an infinite series solution for the computation of TED in small-sized circular plates. Following a comparative analysis of the proposed model with prior studies, convergence studies are conducted to identify the optimal number of terms needed for trustworthy outcomes. A range of numerical results with the aid of simulated model are also prepared, with a focus on analyzing the distinctions between 1D and 2D models as well as the implications of using the MCST and MGT model. The findings betoken apparent deviations between the predictions of the new 2D size-dependent model and the 1D traditional formulation, especially for tiny and relatively thick circular plates.

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小尺寸圆板的热弹性阻尼与尺寸相关的力学和热性能的二维建模
在微纳米力学领域,热弹性阻尼(TED)被认为是机械结构能量耗散的一个重要因素。因此,为这种现象开发一个精确的模型对于获得极小谐振器的最佳性能至关重要。考虑到多维传热建模相对于一维(1D)建模的优越性,以及尺寸效应对机械场和热场的确定性,本文利用修正耦合应力理论(MCST)和Moore-Gibson-Thompson (MGT)热方程的能力,建立了一个数学框架来评估具有二维(2D)热传导的圆形微/纳米板的TED。为了展开研究,基于MCST和MGT模型,建立了圆板的本构方程和热方程。通过求解二维热方程,确定了板内温度的空间分布。利用先前得到的基于应力的耦合本构方程和温度分布函数,导出了单振动周期内损耗能和弹性能的数学表达式。最后,将导出的表达式代入能量耗散(ED)方法的公式,得到小尺寸圆板中能量耗散计算的无穷级数解。在对所提出的模型与先前的研究进行比较分析之后,进行了收敛性研究,以确定值得信赖的结果所需的最佳术语数量。在模拟模型的帮助下,还准备了一系列数值结果,重点分析了一维和二维模型的区别以及使用MCST和MGT模型的意义。这些发现表明,新的2D尺寸依赖模型的预测与1D传统公式之间存在明显的偏差,特别是对于较小且相对较厚的圆形板。
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来源期刊
Archives of Civil and Mechanical Engineering
Archives of Civil and Mechanical Engineering 工程技术-材料科学:综合
CiteScore
6.80
自引率
9.10%
发文量
201
审稿时长
4 months
期刊介绍: Archives of Civil and Mechanical Engineering (ACME) publishes both theoretical and experimental original research articles which explore or exploit new ideas and techniques in three main areas: structural engineering, mechanics of materials and materials science. The aim of the journal is to advance science related to structural engineering focusing on structures, machines and mechanical systems. The journal also promotes advancement in the area of mechanics of materials, by publishing most recent findings in elasticity, plasticity, rheology, fatigue and fracture mechanics. The third area the journal is concentrating on is materials science, with emphasis on metals, composites, etc., their structures and properties as well as methods of evaluation. In addition to research papers, the Editorial Board welcomes state-of-the-art reviews on specialized topics. All such articles have to be sent to the Editor-in-Chief before submission for pre-submission review process. Only articles approved by the Editor-in-Chief in pre-submission process can be submitted to the journal for further processing. Approval in pre-submission stage doesn''t guarantee acceptance for publication as all papers are subject to a regular referee procedure.
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