Competitive correlation between the interface layers determines the shear strength in Kovar/AgCuTi/Si3N4 joints

IF 2.3 4区 材料科学 Q2 MATERIALS SCIENCE, CERAMICS International Journal of Applied Ceramic Technology Pub Date : 2024-10-11 DOI:10.1111/ijac.14920
Haifeng Xu, Jie Wang, Fengsong Fan, Zepeng Zhang, Deyin Zhang, Haoyang Wu, Zhirui Zhang, Aimin Chu, Baorui Jia, Enxiang Pu, Xuanhui Qu, Mingli Qin
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Abstract

As a promising high-thermal-conductivity ceramics, the direct bonding of Si3N4 with metals remains challenging. Here, we employed active metal brazing of Si3N4 ceramics and Kovar alloys using AgCuTi metal filler, and found that the shear strength in the prepared Kovar/AgCuTi/Si3N4 joints depends on the competitive correlation between the interface layers. The competitive consumption for active element Ti by Kovar/AgCuTi interfacial reactions reduced AgCuTi/Si3N4 interface layer thickness and deteriorated final shear strength, even when using a high-Ti-content filler. Surface analysis indicated that interfacial fracture between Ag-based solid solution and Ti5Si3 was the primary cause of failure. Density functional theory (DFT) revealed that Ag (111)/Fe2Ti (001) interface had higher ideal work of adhesion (Wad) than Ag (111)/Ti5Si3 (001) interface, confirming the importance of AgCuTi/Si3N4 interface layer. Ultimately, by adjusting interface reaction layer thickness, the joints reached a high shear strength of 154.3 MPa.

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界面层间的竞争关系决定了Kovar/AgCuTi/Si3N4节理的抗剪强度
作为一种很有前途的高导热陶瓷,氮化硅与金属的直接键合仍然是一个挑战。本文采用AgCuTi金属填充物对Si3N4陶瓷和Kovar合金进行活性金属钎焊,发现制备的Kovar/AgCuTi/Si3N4接头的抗剪强度取决于界面层之间的竞争相关性。Kovar/AgCuTi界面反应对活性元素Ti的竞争性消耗降低了AgCuTi/Si3N4界面层厚度,并降低了最终抗剪强度,即使使用高Ti含量的填料也是如此。表面分析表明,ag基固溶体与Ti5Si3之间的界面断裂是失效的主要原因。密度泛函理论(DFT)表明,Ag (111)/Fe2Ti(001)界面具有比Ag (111)/Ti5Si3(001)界面更高的理想粘附功(Wad),证实了AgCuTi/Si3N4界面层的重要性。最终通过调整界面反应层厚度,节理抗剪强度达到154.3 MPa。
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来源期刊
International Journal of Applied Ceramic Technology
International Journal of Applied Ceramic Technology 工程技术-材料科学:硅酸盐
CiteScore
3.90
自引率
9.50%
发文量
280
审稿时长
4.5 months
期刊介绍: The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas: Nanotechnology applications; Ceramic Armor; Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors); Ceramic Matrix Composites; Functional Materials; Thermal and Environmental Barrier Coatings; Bioceramic Applications; Green Manufacturing; Ceramic Processing; Glass Technology; Fiber optics; Ceramics in Environmental Applications; Ceramics in Electronic, Photonic and Magnetic Applications;
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