Study on surface integrity of RS-SiC under photocatalysis/vibration-assisted finishing

IF 6.8 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-01-31 Epub Date: 2025-01-03 DOI:10.1016/j.jmapro.2024.12.050
Zhichao Geng, Yang He, Fengzhou Fang
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Abstract

Reaction-sintered silicon carbide (RS-SiC) is widely used in optical mirrors for space exploration. Maintaining surface integrity by obtaining both high surface finish and minimal subsurface damage is critical for achieving optimal performance. However, conventional machining processes struggle to meet these requirements because of high hardness and brittleness of RS-SiC. This paper presents a novel photocatalysis/vibration-assisted finishing technique and provides a systematic analysis of polished RS-SiC, including surface and subsurface characteristics. The involved process generates a softer, smoother, and amorphous oxide layer, significantly enhancing polishing efficiency and achieving a surface roughness of 0.25 nm in Ra. And the subsurface damage is minimized effectively. This study confirms that photocatalysis/vibration-assisted finishing is an eco-friendly ultra-precision polishing technology with the potential to achieve damage-free processing.
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光催化/振动辅助整理下RS-SiC表面完整性的研究
反应烧结碳化硅(RS-SiC)广泛应用于空间探测光学反射镜中。通过获得高表面光洁度和最小的亚表面损伤来保持表面完整性是实现最佳性能的关键。然而,由于RS-SiC的高硬度和高脆性,传统的加工工艺难以满足这些要求。本文提出了一种新的光催化/振动辅助抛光技术,并对抛光后的RS-SiC进行了系统的分析,包括表面和表面下的特性。所涉及的工艺产生了更柔软,更光滑的非晶态氧化层,显着提高了抛光效率,并在Ra中实现了0.25 nm的表面粗糙度。有效地减少了地下损伤。这项研究证实,光催化/振动辅助抛光是一种环保的超精密抛光技术,具有实现无损伤加工的潜力。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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