Yu Jiang , Bo Zhang , Wenhu Han , Xuechen Niu , Mingtao Zeng , Dong Ye , Weiwei Deng , Lianbo Guo , Guanjun Zhang , YongAn Huang
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引用次数: 0
Abstract
The rapid evolution of conformal electronics necessitates advancements in high-resolution printing on three-dimensional curved insulating surfaces directly. A recently developed technique, known as plasma-induced electrohydrodynamic (PiE) printing, is a promising technique that enables micron and submicron scale printing on arbitrary dielectric substrates. However, factors that govern the deposited charges and the effects of the constructed electric field on induced jetting behavior have not been fully comprehended. Here, we investigate the role of plasma-surface interaction in PiE printing and its impact on the printing process. The local electric field, constructed by site-selective deposition of positive charges on the dielectric surfaces through plasma jet impingement, forms a spatial region of effective influence. The geometrical and electrical parameters of the PiE printing system significantly influence the spreading range and intensity of plasma on the surface and hence the effective region, and therefore determines the induced ink jetting behavior and the jets/droplets traction and deflection. Our study reveals the relationship between the plasma jet and inkjet dynamics in PiE printing, providing insights into the interplay between the plasma spreading behavior and process parameters. The optimization of these parameters can enable better performance of high-quality PiE printing.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.