TDSF: Two-phase tamper detection in semi-fragile watermarking using two-level integer wavelet transform

IF 5.4 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY Engineering Science and Technology-An International Journal-Jestech Pub Date : 2025-01-01 Epub Date: 2024-12-03 DOI:10.1016/j.jestch.2024.101909
Agit Amrullah , Ferda Ernawan , Anis Farihan Mat Raffei , Liew Siau Chuin
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Abstract

Image watermarking is one of techniques that can be used to protect and recover from the altered images. Tamper detection in semi-fragile still does not achieve high accuracy for tamper localization, especially in malicious attacks. This study proposes two-phase tamper detection in semi-fragile image watermarking using two-level Integer Wavelet Transform (IWT). The study proposes two-phases of tamper detection to achieve a high level of accuracy in the tamper localization. The initial phase will check four segments to determine the tampered bit or not. A tampered segment is identified if it contains at least one tampered bit. The second phase will be performed if the first phase has no tampered bit. The second phase checked each segment to determine whether it was tampered with or not. This study also used Normalized Hamming Similarity (NHS) to classify malicious and incidental attacks. The proposed scheme performed two-level integer wavelets transform to obtain the LL, LH, HL, and HH sub-bands. The authentication bits of LL are embedded into the LH and HL sub-bands to generate a watermarked image. The LH and HL are compared using XOR bitwise with authentication bit to localize the tamper detection. The experimental results show that the proposed scheme achieved high quality of the recovered images with an average PSNR score of 44.1864 dB, wPSNR score of 46.2218 dB and SSIM score of 0.9945. The proposed method produced high accuracy of tamper detection of about 98.33 % under object manipulation with the tampering rate of about 12.1643 %.
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TDSF:基于两级整数小波变换的半脆弱水印两相篡改检测
图像水印是一种用于保护和恢复被改变的图像的技术。半脆弱环境下的篡改检测在篡改定位方面准确率仍然不高,尤其是在恶意攻击中。提出了一种基于两级整数小波变换(IWT)的半脆弱图像水印的两相篡改检测方法。该研究提出了两阶段的篡改检测,以实现篡改定位的高水平准确性。初始阶段将检查四个片段以确定是否篡改了位。如果一个被篡改的段至少包含一个被篡改的位,那么它就是被识别的。如果第一阶段的钻头没有被篡改,则执行第二阶段。第二阶段检查每个片段,以确定它是否被篡改。本研究还使用归一化汉明相似度(NHS)对恶意攻击和附带攻击进行分类。该方案通过两级整数小波变换得到LL、LH、HL和HH子带。将LL的认证位嵌入到LH和HL子带中,生成水印图像。将LH和HL与认证位进行异或比较,以定位篡改检测。实验结果表明,该方案获得了高质量的恢复图像,平均PSNR评分为44.1864 dB, wPSNR评分为46.2218 dB, SSIM评分为0.9945。该方法在目标操纵下的篡改检测准确率高达98.33%,篡改率约为12.1643%。
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来源期刊
Engineering Science and Technology-An International Journal-Jestech
Engineering Science and Technology-An International Journal-Jestech Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.20
自引率
3.50%
发文量
153
审稿时长
22 days
期刊介绍: Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. The scope of JESTECH includes a wide spectrum of subjects including: -Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing) -Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences) -Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)
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