Over 20 % improvement of current-gain cut off frequency 0.3 μm AlGaN/GaN HEMTs with ultra-low Von Schottky Drain for broadband application

IF 3 Q2 PHYSICS, CONDENSED MATTER Micro and Nanostructures Pub Date : 2025-03-01 Epub Date: 2025-01-25 DOI:10.1016/j.micrna.2025.208076
Zhe Lin , Jihong Ding , Hanzhao He , Dongsheng Liu , Wei Huang , Liang Li , D.W. Zhang , Hao Yu , Xubo Song , Yuanjie Lv , Zhihong Feng , Baitong Fang , Kai Zhang , Debin Zhang
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Abstract

This letter demonstrates firstly the novel IESD HEMT (Inserting Etched Schottky Drain HEMT) with the lower barrier height for the broadband and high temperature application of millimeter wave. The etched Schottky device is formed adjacent along AlGaN/GaN sidewalls into drain region and the turn-on voltage is almost about 0 V with the barrier height about 0.49 eV, 0.02 eV lower than that of conventional AlGaN/GaN SBD (Schottky Barrier Diode). Due to the hot electron emission effect of the inserted Schottky barrier diode, the results show that the HEMTs device can obtain better electrical characteristics with wide bandwidth in wider temperature range from 25 °C to 125 °C, specially improved on high frequency. The fabricated HEMTs show a high current density of 550 mA/mm and a high transconductance of 168 mS/mm (VDS = 10V). Based on the nonlinear rectifying characteristics of SBD with containing RF harmonic components, the cut-off frequency fT of IESD HEMT exceeds 75.7 GHz which is about 20 % higher than conventional AlGaN/GaN HEMT devices.
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具有超低冯肖特基漏极的宽带应用中电流增益截止频率0.3 μm的AlGaN/GaN hemt提高20%以上
本文首先展示了具有较低势垒高度的新型IESD HEMT(插入蚀刻肖特基漏极HEMT),用于毫米波的宽带和高温应用。蚀刻肖特基器件沿AlGaN/GaN的侧壁相邻形成漏极区,导通电压约为0 V,势垒高度约为0.49 eV,比传统的AlGaN/GaN SBD(肖特基势垒二极管)低0.02 eV。结果表明,由于插入肖特基势垒二极管的热电子发射效应,hemt器件在25℃~ 125℃较宽的温度范围内可以获得较好的电特性和较宽的带宽,特别是在高频方面得到了改善。制备的hemt具有550 mA/mm的高电流密度和168 mS/mm的高跨导(VDS = 10V)。基于含射频谐波的SBD的非线性整流特性,IESD HEMT的截止频率fT超过75.7 GHz,比传统的AlGaN/GaN HEMT器件提高约20%。
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