This paper presents a comprehensive and rigorous review of the most significant Tunnel Field-Effect Transistor (TFET) architectures extensively studied in recent research. We systematically and hierarchically analyze TFETs based on diverse engineering approaches, including doping modulation, material innovation, ferroelectric-induced negative capacitance, heterodielectric gate formation, overlap/underlap techniques, junctionless designs, and vertical configurations. From viewpoint of compatibility by CMOS process, the scope is intentionally biased toward bulk/SiGe-based and vertical TFETs by also investigating the TFETs employing two-dimensional (2D) materials, which are critical for ultrascale applications owing to their superior control over short-channel effects. Furthermore, the potential of novel TFETs as highly sensitive biosensors and gas sensors is thoroughly examined, with a detailed comparison of their electrical performance and sensing capabilities. The study highlights the inherent advantages and limitations of each of the TFET categories, providing an outstanding understanding of their operational trade-offs. Through an extensive comparative analysis, we identify the optimal TFET device in terms of electrical performance in each TFET category, offering valuable guidance for VLSI designers in selecting TFETs tailored to specific application requirements. Additionally, the best TFET device among all these categories has been selected to provide a practical path for circuit and process engineers to design based on high-performance architectures. This work not only consolidates current knowledge but also paves the way for future innovations in TFET-based sensor technologies and nanoscale electronic devices, underscoring the fundamental role of device architecture and material choice in advancing next-generation integrated circuits.
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