Thermal gradient-induced full intermetallic joints formation for chip bonding

IF 4.8 2区材料科学 Q2 CHEMISTRY, PHYSICAL Intermetallics Pub Date : 2025-01-07 DOI:10.1016/j.intermet.2025.108647

Ning Zhou , Qilong Guan , Shengli Li , Lin Wu , Xiaojiu Tang , Jian Guo , Chunjin Hang , Wei Zhang

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Abstract

Solid-liquid interdiffusion bonding (SLID) acts as a promising stacking process for three-dimensional integrated circuit (3D IC) tacking, but nevertheless is plagued with low throughput. In this work, a new speed solid-liquid interdiffusion bonding process is proposed to improve the bonding reliability. Different from the homogeneous bonding temperature, a temperature gradient superposition is applied across the joint in the new process. Firstly, the new method is 5–7 times faster than that of the traditional bonding process, depending on the bonding temperatures and times. On the other hand, the asymmetric dissolution of Cu/Sn-3.0Ag-0.5Cu/Cu (Cu/SAC305/Cu) solder joints induced by large temperature gradient (0.1 °C/μm) leads the asymmetric growth of intermetallic compounds (IMCs) at the cold end. Besides, the morphologies of IMCs layer transforms from scallop-like grains to columnary grains at the cold end. In addition, the shear property of the solder joints obviously increases with the extension of the bonding times. The bonding mechanism of the solder joints is provided and experimentally confirmed in this work.

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热梯度诱导全金属间接头形成的芯片键合

固液扩散键合（slip）是三维集成电路（3D IC）粘接中很有前途的一种堆叠工艺，但其吞吐量低。本文提出了一种新的高速固液互扩散连接工艺，以提高连接的可靠性。与均匀焊温不同的是，在焊接过程中采用了温度梯度叠加。首先，根据键合温度和时间的不同，新方法比传统的键合工艺快5-7倍。另一方面，大温度梯度（0.1°C/μm）诱导Cu/Sn-3.0Ag-0.5Cu/Cu （Cu/SAC305/Cu）焊点的不对称溶解导致冷端金属间化合物（IMCs）的不对称生长。冷端IMCs层形态由扇贝状晶粒转变为柱状晶粒。此外，随着焊接次数的增加，焊点的剪切性能明显提高。提出了焊点的键合机理，并进行了实验验证。

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来源期刊

Intermetallics 工程技术-材料科学：综合

CiteScore

7.80

自引率

9.10%

发文量

291

审稿时长

37 days

期刊介绍： This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys. The journal reports the science and engineering of metallic materials in the following aspects: Theories and experiments which address the relationship between property and structure in all length scales. Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations. Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties. Technological applications resulting from the understanding of property-structure relationship in materials. Novel and cutting-edge results warranting rapid communication. The journal also publishes special issues on selected topics and overviews by invitation only.