Effect of UV-illumination on electrochemical anodic oxidation of SiC

IF 7.5 2区 材料科学 Q1 ENGINEERING, INDUSTRIAL Journal of Materials Processing Technology Pub Date : 2025-02-01 DOI:10.1016/j.jmatprotec.2024.118703
Zhenghao Wei , Zhiyu Wang , Huiqiang Liang , Junqiang Li , Jiongchong Fang , Wenjun Lu , Jiawen Zhang , Haifeng Gao , Zhongdu He , Yu Guo , Xu Sui , Guosong Zeng
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Abstract

Introducing an external energy field to force the oxidation of SiC is considered as an effective way to address the current challenge of chemical mechanical polishing (CMP) for SiC fabrication. In this study, we firstly compared several reported oxidation methods that have been used in different CMP-based techniques for SiC substrate, and demonstrated that the electrochemical (EC) and photoelectrochemical (PEC) anodic oxidations had significant advancement of the oxidation efficiency. Further comparison between EC and PEC revealed that PEC produced more uniform and smoother oxide layers in similar oxidation rates, while applied voltage and light intensity played a composing role in controlling the outcome. The quasi-in situ (photo)electrochemical atomic force microscopy analysis on the nanoindentation introduced artificial defects unraveled that, holes were prone to gather around the defective regions and resulted in faster oxidation rate, while the PEC can suppress such selective oxidation. These results suggest that the introduction of light has the potential to address the long-standing challenge of poor surface quality in electrochemical mechanical polishing (ECMP), not only for SiC but for various different semiconductor materials, and provide practical guidance for the industry to enhance PECMP performance on SiC and other hard and chemical inert semiconductor materials through optimizing oxidation processes.
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紫外光照对SiC电化学阳极氧化的影响
引入外部能量场来强迫SiC氧化被认为是解决当前化学机械抛光(CMP)在SiC制造中的挑战的有效途径。在这项研究中,我们首先比较了几种已经报道的氧化方法在不同的cmp技术中对SiC衬底的氧化,并证明了电化学(EC)和光电化学(PEC)阳极氧化在氧化效率上有显著的提高。EC和PEC的进一步比较表明,PEC在相似的氧化速率下产生更均匀和光滑的氧化层,而施加电压和光强对结果起组成控制作用。准原位(照片)电化学原子力显微镜对纳米压痕进行分析,发现人工缺陷揭开后,气孔容易聚集在缺陷区域周围,导致氧化速度加快,而PEC可以抑制这种选择性氧化。这些结果表明,光的引入有可能解决长期存在的电化学机械抛光(ECMP)表面质量差的挑战,不仅适用于SiC,也适用于各种不同的半导体材料,并为工业提供实践指导,通过优化氧化工艺来提高电化学机械抛光(ECMP)在SiC和其他硬质和化学惰性半导体材料上的性能。
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来源期刊
Journal of Materials Processing Technology
Journal of Materials Processing Technology 工程技术-材料科学:综合
CiteScore
12.60
自引率
4.80%
发文量
403
审稿时长
29 days
期刊介绍: The Journal of Materials Processing Technology covers the processing techniques used in manufacturing components from metals and other materials. The journal aims to publish full research papers of original, significant and rigorous work and so to contribute to increased production efficiency and improved component performance. Areas of interest to the journal include: • Casting, forming and machining • Additive processing and joining technologies • The evolution of material properties under the specific conditions met in manufacturing processes • Surface engineering when it relates specifically to a manufacturing process • Design and behavior of equipment and tools.
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