Preparation and performance study of cBN/AlN/Al thermal conductive composites under high temperature and high pressure

Abstract

To solve the problem that traditional heat dissipation materials cannot meet the heat dissipation requirements of highly integrated electronic devices under high heat flux density, this paper uses the performance characteristics of cubic boron nitride with high thermal conductivity, high-temperature resistance, oxidation resistance, and good chemical stability, and uses a cubic press to prepare cBN/AlN/Al thermally conductive composites under high temperature and high-pressure conditions. The effects of the added phase system and content, sintering temperature, and other factors on the preparation and properties of cBN/AlN/Al thermally conductive composites were studied. The results show that under the sintering conditions of 5.0 GPa and 1500 °C, the cBN/AlN/Al thermal conductivity composites with the best performance are obtained by adding AlN/Al binder with a mass fraction of 20 %, with relative density and thermal conductivity of 98.8 % and 259 W/(m·K, respectively), which can be used as an ideal material for the preparation of heat dissipation substrates.