Creep-fatigue behavior of a friction stir welding 7050-T7451 aluminum alloy: Microstructure evolution and microscopic damage mechanisms

IF 6.8 2区 材料科学 Q1 ENGINEERING, MECHANICAL International Journal of Fatigue Pub Date : 2025-05-01 Epub Date: 2025-01-30 DOI:10.1016/j.ijfatigue.2025.108840
Huan Wang, Weifeng Xu, Yanfei Wang, Hongjian Lu
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Abstract

Creep-fatigue behavior of a friction stir welding (FSW) Al-Zn-Mg-Cu alloy at different temperatures was investigated. The results show that creep damage is much higher than fatigue damage when a holding time is introduced at the peak load. After creep-fatigue, η’ and η phases are reprecipitated in the weld nugget zone (WNZ) and coarsen with increasing temperature. When the creep-fatigue temperature is below 175 °C, the predominant deformation mechanism is dislocation slip in the heat affected zone (HAZ). The Hall-Petch relationship prevails and thus the fine-grained WNZ is strengthened. The voids and microcracks nucleate at the interiors of coarse second phase particles or interfaces between the matrix and second phases. The FSW joints are fractured at the HAZ, characterized by the transgranular ductile fracture mode. Grain boundary ledges are observed in the WNZ at the creep-fatigue temperature of 200°C, suggesting the occurrence of grain boundary sliding. The plastic deformation of FSW joints is governed by GB-mediated deformation mechanism in the WNZ, indicating the inverse Hall-Petch behavior. Intergranular voids or microcracks initiate from grain boundaries with low values of the Schmid factor and geometric compatibility factor. The fracture mode of FSW joints is dominated by the intergranular fracture in the WNZ.
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7050-T7451铝合金搅拌摩擦焊接蠕变疲劳行为:显微组织演变和微观损伤机制
研究了搅拌摩擦焊Al-Zn-Mg-Cu合金在不同温度下的蠕变疲劳行为。结果表明,在峰值荷载下引入保温时间时,蠕变损伤要远大于疲劳损伤。蠕变疲劳后,η′和η相在焊缝熔核区(WNZ)再析出,并随着温度的升高而变粗。当蠕变疲劳温度低于175℃时,热影响区(HAZ)的主要变形机制是位错滑移。Hall-Petch关系盛行,因此细粒度的WNZ得到加强。孔洞和微裂纹在粗第二相颗粒内部或基体与第二相界面处成核。FSW接头在热影响区断裂,表现为穿晶韧性断裂模式。蠕变疲劳温度为200℃时,WNZ内出现晶界边缘,表明晶界发生滑动。摩擦焊接头在WNZ内的塑性变形受gb介导的变形机制支配,表现出相反的Hall-Petch行为。当施密德系数和几何相容系数较低时,晶间孔洞或微裂纹开始于晶界。FSW接头的断裂模式以WNZ的晶间断裂为主。
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来源期刊
International Journal of Fatigue
International Journal of Fatigue 工程技术-材料科学:综合
CiteScore
10.70
自引率
21.70%
发文量
619
审稿时长
58 days
期刊介绍: Typical subjects discussed in International Journal of Fatigue address: Novel fatigue testing and characterization methods (new kinds of fatigue tests, critical evaluation of existing methods, in situ measurement of fatigue degradation, non-contact field measurements) Multiaxial fatigue and complex loading effects of materials and structures, exploring state-of-the-art concepts in degradation under cyclic loading Fatigue in the very high cycle regime, including failure mode transitions from surface to subsurface, effects of surface treatment, processing, and loading conditions Modeling (including degradation processes and related driving forces, multiscale/multi-resolution methods, computational hierarchical and concurrent methods for coupled component and material responses, novel methods for notch root analysis, fracture mechanics, damage mechanics, crack growth kinetics, life prediction and durability, and prediction of stochastic fatigue behavior reflecting microstructure and service conditions) Models for early stages of fatigue crack formation and growth that explicitly consider microstructure and relevant materials science aspects Understanding the influence or manufacturing and processing route on fatigue degradation, and embedding this understanding in more predictive schemes for mitigation and design against fatigue Prognosis and damage state awareness (including sensors, monitoring, methodology, interactive control, accelerated methods, data interpretation) Applications of technologies associated with fatigue and their implications for structural integrity and reliability. This includes issues related to design, operation and maintenance, i.e., life cycle engineering Smart materials and structures that can sense and mitigate fatigue degradation Fatigue of devices and structures at small scales, including effects of process route and surfaces/interfaces.
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