Yu Wang , Helei Dong , Zhen Jia , Yuxin Miao , Jie Ma , Zhonghai Luo , Lei Zhang , Yongqiang Qin , Qiulin Tan
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引用次数: 0
Abstract
In this paper, an indium tin oxide (ITO) and indium oxide (In2O3) slurry that can be used for low-temperature sintering was prepared, after which an ITO/In2O3 thermocouple was prepared on an aluminum oxide (Al2O3) ceramic substrate using a screen-printing process for verifying its comprehensive performance. The samples were treated at an annealing temperature of 900 °C for different times. The characterization results show that when the annealing time is set to 3 h, the ITO film has the best crystallization effect. Moreover, under this annealing condition, Sn2⁺ ions are more inclined to transform into Sn⁴⁺ ions, promoting the release of additional free electrons, which significantly enhances the thermoelectric effect. The test result of its electrical conductivity is 134.2 s/cm. Within the temperature range of 900 °C, the thermocouple has an ultra-high Seebeck coefficient of 410.91 μV/°C, and the peak output voltage is 332.8 mV. The maximum repeatability error is 2.745 %. It can be seen that the slurry prepared in this paper has excellent electrical properties after sintering at 900 °C, and is expected to become a feasible substitute in the field of conductive slurry of low temperature co-fired ceramic (LTCC).
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.