Modulation of pore structure in SiC porous ceramics: Impact of SiC powder particle size and distribution span

IF 4.7 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Chemistry and Physics Pub Date : 2025-02-07 DOI:10.1016/j.matchemphys.2025.130504
Xinjian Ke , Jinhua Zhang , Qingqing Jin , Yu'e Ni , Jingran Wang , Hongdan Wu
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Abstract

According to particle packing theory, SiC porous ceramics with tailored porosity and pore dimensions can be fabricated by modifying the particle size and distribution range of SiC powder via the pressureless sintering method. The density of the green body formed under uniaxial pressure markedly diminishes with a reduction in particle packing density, while the apparent porosity of the SiC porous ceramics produced through high-temperature sintering significantly increases, resulting in a substantial enhancement of pure water flux. The increased span of SiC particle size distribution allows fine particles to efficiently occupy the interstices between larger particles, enhancing the densification of both the green and sintered bodies. Concurrently, the fine particles refine the pore size by filling larger voids; however, this results in a reduction of pure water flux. A reduction in particle size can lead to a drop in pore size of SiC porous ceramics when the particle size distribution range is comparable.
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碳化硅多孔陶瓷孔隙结构的调制:碳化硅粉末粒度和分布跨度的影响
根据颗粒填充理论,通过无压烧结的方法,改变碳化硅粉末的粒径和分布范围,可以制备出具有定制孔隙度和孔径的碳化硅多孔陶瓷。单轴压力下形成的坯体密度随着颗粒堆积密度的降低而显著减小,而高温烧结制备的SiC多孔陶瓷的表观孔隙率显著增加,纯水通量大幅增强。SiC粒度分布范围的扩大使得细小颗粒能够有效地占据较大颗粒之间的间隙,从而增强了生坯和烧结体的致密性。同时,细颗粒通过填充更大的空隙来细化孔径;然而,这导致纯水通量的减少。当粒径分布范围相当时,减小粒径可导致SiC多孔陶瓷的孔径减小。
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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