High-Responsivity Flexible InGaN/GaN MQWs Nanomembrane Photodetectors With DBR Mirror Toward Visible Light Communication

IF 4.1 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-12-09 DOI:10.1109/LED.2024.3513417

Liang Chen;Wenliang Wang;Guoqiang Li

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引用次数: 0

Abstract

Flexible InGaN-based photodetectors have broad application prospects in wearable biometric monitoring and visible light communication (VLC). However, flexible InGaN-based visible light photodetectors (VLPDs) still face challenges of low responsivity due to poor material quality and low light absorption efficiency. This work demonstrates a high-performance flexible VLPD integrating a TiO2/SiO2 distributed Bragg reflector (DBR) mirror with an InGaN/GaN MQWs nanomembrane. The optical field density is significantly enhanced by introducing the DBR mirror, resulting in a 22% improvement in PD’s responsivity (68.6 mA/W@-1 V). The photoresponse time (

$\text {T} _{\text {r}}$

$\text {T} _{\text {f}}\text {)}$

of PD are

$24.4~\mu $

s and

$6.1~\mu $

s, respectively. The −3 dB bandwidth of PD is 106.2 kHz. The flexible PD exhibits good stability over multiple bending cycles and long periods in the air. A real-time and precise VLC system link has been established based on high-performance flexible PDs, achieving a data rate of 9 Kbps. This research offers a strategic approach for designing high-performance flexible VLPDs towards VLC.

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来源期刊

IEEE Electron Device Letters 工程技术-工程：电子与电气

CiteScore

8.20

自引率

10.20%

发文量

551

审稿时长

1.4 months

期刊介绍： IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.

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