Microstructures and mechanical properties of a 30CrNi2MoV steel/GH4098 joint produced by hot-compression bonding

IF 7.9 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials & Design Pub Date : 2025-02-04 DOI:10.1016/j.matdes.2025.113693

Shengqing Wu , Sheng Liu , Hexin Wang , Shaofei Ren , Bin Xu , Xiaopeng Zhang , Mingyue Sun

{"title":"Microstructures and mechanical properties of a 30CrNi2MoV steel/GH4098 joint produced by hot-compression bonding","authors":"Shengqing Wu , Sheng Liu , Hexin Wang , Shaofei Ren , Bin Xu , Xiaopeng Zhang , Mingyue Sun","doi":"10.1016/j.matdes.2025.113693","DOIUrl":null,"url":null,"abstract":"<div><div>This study elucidates the microstructures and mechanical properties of a 30CrNi2MoV steel/GH4098 joint produced via hot-compression bonding (HCB). Owing to the mutual diffusion of GH4098 and 30CrNi2MoV, the bonding interface becomes an interface band where Al<sub>2</sub>O<sub>3</sub>/Ti(C, N) is distributed on the side near GH4098 and Ti(C, N)/M<sub>23</sub>C<sub>6</sub> is distributed on the side near 30CrNi2MoV. A transition layer occurs between the interface band and 30CrNi2MoV due to the diffusion of austenite stabilization elements dominated by Ni from GH4098 to 30CrNi2MoV. As the hot compression temperature increases, oxides and carbides are thermally dissolved into the matrix and Al<sub>2</sub>O<sub>3</sub> transitions from its δ phase to α phase. As the strain increases, the bonding interface bugles and the interfacial oxide layer is destroyed. The highest interfacial bonding strength is obtained under conditions associated with high temperatures and large deformation.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"251 ","pages":"Article 113693"},"PeriodicalIF":7.9000,"publicationDate":"2025-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials & Design","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0264127525001133","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

This study elucidates the microstructures and mechanical properties of a 30CrNi2MoV steel/GH4098 joint produced via hot-compression bonding (HCB). Owing to the mutual diffusion of GH4098 and 30CrNi2MoV, the bonding interface becomes an interface band where Al₂O₃/Ti(C, N) is distributed on the side near GH4098 and Ti(C, N)/M₂₃C₆ is distributed on the side near 30CrNi2MoV. A transition layer occurs between the interface band and 30CrNi2MoV due to the diffusion of austenite stabilization elements dominated by Ni from GH4098 to 30CrNi2MoV. As the hot compression temperature increases, oxides and carbides are thermally dissolved into the matrix and Al₂O₃ transitions from its δ phase to α phase. As the strain increases, the bonding interface bugles and the interfacial oxide layer is destroyed. The highest interfacial bonding strength is obtained under conditions associated with high temperatures and large deformation.

Abstract Image

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

30CrNi2MoV钢/GH4098热压焊接接头的组织与力学性能

研究了30CrNi2MoV钢/GH4098热压结合接头的组织和力学性能。由于GH4098与30CrNi2MoV的相互扩散，结合界面形成Al2O3/Ti（C， N）分布在GH4098附近一侧，Ti(C， N)/M23C6分布在30CrNi2MoV附近一侧的界面带。由于以Ni为主的奥氏体稳定元素从GH4098向30CrNi2MoV扩散，在界面带与30CrNi2MoV之间形成过渡层。随着热压缩温度的升高，氧化物和碳化物被热溶解到基体中，Al2O3由δ相转变为α相。随着应变的增加，结合界面出现气泡，界面氧化层被破坏。在高温和大变形条件下，界面结合强度最高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Materials & Design Engineering-Mechanical Engineering

CiteScore

14.30

自引率

7.10%

发文量

1028

审稿时长

85 days

期刊介绍： Materials and Design is a multi-disciplinary journal that publishes original research reports, review articles, and express communications. The journal focuses on studying the structure and properties of inorganic and organic materials, advancements in synthesis, processing, characterization, and testing, the design of materials and engineering systems, and their applications in technology. It aims to bring together various aspects of materials science, engineering, physics, and chemistry. The journal explores themes ranging from materials to design and aims to reveal the connections between natural and artificial materials, as well as experiment and modeling. Manuscripts submitted to Materials and Design should contain elements of discovery and surprise, as they often contribute new insights into the architecture and function of matter.