Development and evaluation of a multi-functional heat pump with embedded thermal storage

IF 6.1 2区 工程技术 Q2 ENERGY & FUELS Applied Thermal Engineering Pub Date : 2025-02-07 DOI:10.1016/j.applthermaleng.2025.125862
Yifeng Hu, Bo Shen
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Abstract

We developed and tested a novel multi-functional packaged vertical heat pump designed for multi-family buildings, capable of providing space cooling, space heating, water heating, and energy storage integration. The system employs a 3-speed scroll compressor and supports energy-efficient cooling and heating across different ambient conditions, while utilizing both indoor and outdoor air sources for water heating. Key performance metrics include an integrated energy efficiency ratio of 18.0 for cooling, a heating seasonal performance factor of 10.0, and a coefficient of performance (COP) of 2.1 for heating in cold climates down to −15 ˚C. Additionally, the system delivers an annual water heating COP greater than 4.0, with outstanding performance in combined space cooling and water heating modes, achieving a total COP of 8.8 by recovering condenser waste heat. The heat pump also demonstrated thermal energy storage capabilities, integrating with phase change material systems to store heating and cooling energy. This versatile system offers a promising solution for improving energy efficiency and sustainability in multi-family buildings, providing high-performance heating, cooling, and water heating across a range of climates.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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