Viscous fingering in adhesive bonding

IF 3.2 3区材料科学 Q2 ENGINEERING, CHEMICAL International Journal of Adhesion and Adhesives Pub Date : 2025-02-05 DOI:10.1016/j.ijadhadh.2025.103960

Mohamad Al Trjman , Alexander H.J. Salten , Felix Beule , Dominik Teutenberg , Gerson Meschut , Julia Riese , Eugeny Y. Kenig

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引用次数: 0

Abstract

Due to the adoption of multi-material construction methods in modern lightweight design, along with the use of adhesive bonding technology, thermally induced relative displacements between the joining components arise during the curing process. As a result, the original bond area is significantly reduced and exhibits a meandering structure. This structure, once cured, can lead to increased stress buildup in the joint due to the reduced adhesive area and the notch effect.

This work focuses on the experimental characterization and numerical description of a problem known as “viscous fingering”. To investigate this, adhesive surface reduction is experimentally investigated using a butt-bonded joint specimen (BJS) and an LWF–KS2 specimen at various displacements. Additionally, two-phase fluid simulations are carried out using computational fluid dynamics (CFD) to predict the formation of the adhesive surface. The finite element (FE) method is also used to analyze the adhesive surface reduction and simulate the mechanical properties of the bonded joint.

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来源期刊

International Journal of Adhesion and Adhesives 工程技术-材料科学：综合

CiteScore

6.90

自引率

8.80%

发文量

200

审稿时长

8.3 months

期刊介绍： The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.