Effect of V2AlC on the microstructure of copper/graphite composite materials

IF 3.9 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2025-04-01 Epub Date: 2025-02-06 DOI:10.1016/j.vacuum.2025.114113
Y. Gong , S. Wang
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Abstract

Copper/graphite composite materials (CGCM) are widely employed as electric contact material in many fields. However, challenges persist due to weak interface bonding. This study investigates the incorporation of V2AlC into CGCM to enhance the bonding at the copper-graphite interface. The results show that at high temperatures, V2AlC decomposes in situ into VC, releasing V atoms that promote the synthesis of a VC layer at the copper-graphite interface. This contributes to a higher nano-indentation hardness at the copper-graphite interface, from 1.46 ± 0.16 GPa to 6.12 ± 0.48 GPa. Additionally, there is a significant improvement in the hardness and compressive strength of CGCM, with hardness increasing from 19.6 ± 1.2 HV0.2 to 76.3 ± 1.6 HV0.2 and compressive strength rising from 132 ± 5 MPa to 218 ± 6 MPa, respectively.
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V2AlC对铜/石墨复合材料微观组织的影响
铜/石墨复合材料作为电接触材料广泛应用于许多领域。然而,由于界面结合薄弱,挑战仍然存在。本研究探讨了在CGCM中加入V2AlC以增强铜-石墨界面的结合。结果表明:在高温下,V2AlC在原位分解成VC,释放出V原子,促进了VC层在铜-石墨界面的合成;这有助于提高铜-石墨界面的纳米压痕硬度,从1.46±0.16 GPa到6.12±0.48 GPa。此外,CGCM的硬度和抗压强度也有显著提高,硬度从19.6±1.2 HV0.2提高到76.3±1.6 HV0.2,抗压强度从132±5 MPa提高到218±6 MPa。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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