Waste iron swarf reinforced epoxy/unsaturated polyester particulate composite films fabrication, characterization and peculiarities

IF 3.4 4区化学 Q2 CHEMISTRY, MULTIDISCIPLINARY Journal of the Indian Chemical Society Pub Date : 2025-03-01 Epub Date: 2025-02-07 DOI:10.1016/j.jics.2025.101619

J. Sagaya Leenu Rathi , Y. Jaya Vinse Ruban , S. Ginil Mon

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Abstract

Waste iron swarf (WIS) reinforced epoxy/unsaturated polyester particulate composite films were fabricated. Elemental analysis was carried out on the waste iron swarf by Energy dispersive X-ray Analysis (EDAX). The waste iron swarf average particle diameter was perceived to be 0.272 μm, which is evidence from particle size analysis. The X-ray Diffraction (XRD) pattern shows the crystalline nature of the WIS filler. The waste iron swarf and engineered composite films were characterized by Fourier-Transform Infrared Spectroscopy (FTIR) to observe the existence of different functional groups. The surface topography of the fabricated composite films was captured by Field Emission Scanning Electron Microscopy (FESEM). This shows the distribution of waste iron swarf and unsaturated polyester in the epoxy matrix. Mechanical peculiarities of the fabricated films were examined with the help of Universal Testing Machine, which shows 30.4 % enhancement in tensile strength than pure epoxy.

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废铁屑增强环氧/不饱和聚酯颗粒复合膜的制备、表征及特性

制备了废铁屑增强环氧/不饱和聚酯颗粒复合膜。利用能量色散x射线分析（EDAX）对废铁屑进行了元素分析。废铁屑的平均粒径为0.272 μm，这是粒度分析的证据。x射线衍射（XRD）图显示了WIS填料的结晶性质。利用傅里叶变换红外光谱（FTIR）对废铁屑和工程复合膜进行了表征，观察了不同官能团的存在。利用场发射扫描电子显微镜（FESEM）捕获了制备的复合薄膜的表面形貌。这显示了废铁屑和不饱和聚酯在环氧基体中的分布。在万能试验机的帮助下，对制备的薄膜的力学特性进行了测试，其拉伸强度比纯环氧树脂提高了30.4%。

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来源期刊

Journal of the Indian Chemical Society 化学-化学综合

CiteScore

3.50

自引率

7.70%

发文量

492

审稿时长

3-8 weeks

期刊介绍： The Journal of the Indian Chemical Society publishes original, fundamental, theorical, experimental research work of highest quality in all areas of chemistry, biochemistry, medicinal chemistry, electrochemistry, agrochemistry, chemical engineering and technology, food chemistry, environmental chemistry, etc.