Time and temperature-dependent fracture mechanics of self-healing vitrimers

IF 4.5 2区 化学 Q2 POLYMER SCIENCE Polymer Pub Date : 2025-03-21 Epub Date: 2025-02-12 DOI:10.1016/j.polymer.2025.128148
Omar El Arwadi , Ajinkya Raut , Jacob L. Meyer , Andreas Polycarpou , Mohammad Naraghi
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Abstract

This study investigates the formation of exchangeable bonds and recovery of load bearing in bulk vitrimers. The critical load required to fracture compact tension samples in bulk aromatic thermosetting co-polyester (ATSP) and the ability of the material to heal the crack was studied as a function of duration and temperature of healing, and number of cycles. We established a marked improvement in healing efficiency at higher temperature especially in the first healing cycle, as the thermal energy reduces the energy barriers for bond re-formation. However, the healing efficiency progressively dropped in four healing cycles, and the drop was more significant at higher temperatures. We analyzed the cure kinetics of the ATSP by means of differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and gel fraction tests. The results showed a particularly good thermal stability below 300 °C. The material loss from gel fraction tests was bound to 0.7 %. While not significant by mass, this mass will turn into volatile species and gas form, occupying a much larger volume, leading to formation of voids which serve as physical barrier to curing (material degredation). This is also evidenced in the increase in the fracture surface roughness, as improper bond exchange lead to the formation of volatile species. The formation of volatile species leads to surface asperities, reducing the contact area between the two faces of the crack, and results in a reduction in healing efficiency. The study concludes by outlining the differences between the intrinsic healing in vitrimers with high vitrification temperature and thermoplastics, highlighting the differences between the molecular mechanisms at play.

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自愈玻璃体的时间和温度相关断裂力学
本研究探讨了大块玻璃体中可交换键的形成和承载能力的恢复。研究了芳香族热固性共聚酯(ATSP)压缩拉伸试样断裂所需的临界载荷以及材料的裂纹愈合能力与修复时间、温度和循环次数的关系。我们发现,在较高温度下,特别是在第一个愈合周期,由于热能降低了键重新形成的能量障碍,愈合效率有了显著提高。然而,在四个愈合周期中,愈合效率逐渐下降,并且在更高的温度下下降更为明显。我们通过差示扫描量热法(DSC)、热重分析(TGA)和凝胶分数测试分析了ATSP的固化动力学。结果表明,该材料在300℃以下具有良好的热稳定性。凝胶分数试验的材料损失限定在0.7%。虽然质量不显著,但这种质量会变成挥发性物质和气体形式,占据更大的体积,导致形成空隙,作为固化(材料降解)的物理屏障。断裂表面粗糙度的增加也证明了这一点,因为不适当的键交换导致挥发性物质的形成。挥发性物质的形成导致表面凹凸不平,减少了裂纹两面之间的接触面积,导致愈合效率降低。该研究总结了高玻璃化温度的玻璃体和热塑性塑料的内在愈合之间的差异,强调了分子机制之间的差异。
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来源期刊
Polymer
Polymer 化学-高分子科学
CiteScore
7.90
自引率
8.70%
发文量
959
审稿时长
32 days
期刊介绍: Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics. The main scope is covered but not limited to the following core areas: Polymer Materials Nanocomposites and hybrid nanomaterials Polymer blends, films, fibres, networks and porous materials Physical Characterization Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films Polymer Engineering Advanced multiscale processing methods Polymer Synthesis, Modification and Self-assembly Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization Technological Applications Polymers for energy generation and storage Polymer membranes for separation technology Polymers for opto- and microelectronics.
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