Laser power bed fusion of TiB2/Cu composite: Densification, microstructure, and properties

IF 5.5 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING Materials Characterization Pub Date : 2025-02-08 DOI:10.1016/j.matchar.2025.114833

Siying Wang , Yanfang Wang , Wenjun Ma , Yihui Jiang , Fei Cao , Chengyu Ma , Shuhua Liang

{"title":"Laser power bed fusion of TiB2/Cu composite: Densification, microstructure, and properties","authors":"Siying Wang , Yanfang Wang , Wenjun Ma , Yihui Jiang , Fei Cao , Chengyu Ma , Shuhua Liang","doi":"10.1016/j.matchar.2025.114833","DOIUrl":null,"url":null,"abstract":"<div><div>Laser powder bed fusion (LPBF) technology has significantly grown to fabricate copper-based material with high degree of control over geometry. The addition of ceramic particles in LPBF of Cu has recently become a promising method for increasing processability and strength while maintaining high conductivity. The work herein produces a high strength and high conductivity Cu composite reinforced by 2 wt% TiB<sub>2</sub> reinforcing particles using LPBF. Adding TiB<sub>2</sub> reinforcing particles could eliminate unmelted powder and cracks, achieving a high relative density of 99 %. Unlike the LPBF of pure Cu with an equiaxed-columnar bimodal grain structure, the TiB<sub>2</sub>/Cu composite presents a fully coarse columnar grain. TiB<sub>2</sub> particles are uniformly distributed within the Cu matrix and provide strengthening contribution of 111 MPa. Compared to the LPBF-fabricated pure Cu, the TiB<sub>2</sub>/Cu composite exhibits a superior combination of strength (∼298 MPa) and electrical conductivity (∼78 % IACS).</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"222 ","pages":"Article 114833"},"PeriodicalIF":5.5000,"publicationDate":"2025-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580325001226","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}

引用次数: 0

Abstract

Laser powder bed fusion (LPBF) technology has significantly grown to fabricate copper-based material with high degree of control over geometry. The addition of ceramic particles in LPBF of Cu has recently become a promising method for increasing processability and strength while maintaining high conductivity. The work herein produces a high strength and high conductivity Cu composite reinforced by 2 wt% TiB₂ reinforcing particles using LPBF. Adding TiB₂ reinforcing particles could eliminate unmelted powder and cracks, achieving a high relative density of 99 %. Unlike the LPBF of pure Cu with an equiaxed-columnar bimodal grain structure, the TiB₂/Cu composite presents a fully coarse columnar grain. TiB₂ particles are uniformly distributed within the Cu matrix and provide strengthening contribution of 111 MPa. Compared to the LPBF-fabricated pure Cu, the TiB₂/Cu composite exhibits a superior combination of strength (∼298 MPa) and electrical conductivity (∼78 % IACS).

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

TiB2/Cu复合材料激光功率床熔接：致密化、显微组织和性能

激光粉末床熔合（LPBF）技术已显著发展到制造具有高度几何控制的铜基材料。近年来，在铜的LPBF中加入陶瓷颗粒已成为一种很有前途的提高加工性能和强度同时保持高导电性的方法。本研究利用LPBF制备了一种由2wt % TiB2增强颗粒增强的高强度、高导电性Cu复合材料。添加TiB2增强颗粒可以消除未熔粉和裂纹，相对密度高达99%。与纯Cu的等轴-柱状双峰晶粒结构不同，TiB2/Cu复合材料呈现完全粗大的柱状晶粒。TiB2颗粒均匀分布在Cu基体内，提供了111 MPa的强化贡献。与lpbf制备的纯Cu相比，TiB2/Cu复合材料具有更高的强度（~ 298 MPa）和导电性（~ 78% IACS）。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.