1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics

IF 4.8 1区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Lightwave Technology Pub Date : 2024-11-07 DOI:10.1109/JLT.2024.3493855
Xin Li;Sajay Bhuvanendran Nair Gourikutty;Jiaqi Wu;Teck Guan Lim;Pengfei Guo;Jaye Charles Davies;Edward Sing Chee Koh;Boon Long Lau;Ming Chinq Jong;Ser Choong Chong;San Sandra;Chao Li;Guo-Qiang Lo;Surya Bhattacharya;Jason Tsung-Yang Liow
{"title":"1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics","authors":"Xin Li;Sajay Bhuvanendran Nair Gourikutty;Jiaqi Wu;Teck Guan Lim;Pengfei Guo;Jaye Charles Davies;Edward Sing Chee Koh;Boon Long Lau;Ming Chinq Jong;Ser Choong Chong;San Sandra;Chao Li;Guo-Qiang Lo;Surya Bhattacharya;Jason Tsung-Yang Liow","doi":"10.1109/JLT.2024.3493855","DOIUrl":null,"url":null,"abstract":"Co-packaged optics (CPO) has emerged as a promising solution to address the limitations of traditional pluggable optical transceivers, offering enhanced bandwidth, improved energy efficiency, and reduced signal loss. This paper presents a low-cost, volume-manufacturable Fan-Out Wafer Level Packaging (FOWLP) silicon photonic engine with an aggregate data transmission capacity of 1.79 Tbps (8 × 224 Gbps). The FOWLP platform enables the seamless integration of Electronic ICs (EICs) and Photonic ICs (PICs) without wire bonds, preserving signal integrity and minimizing losses. By demonstrating 112 Gbaud NRZ (112 Gbps/λ) and PAM4 (224 Gbps/λ) transmission with minimal digital signal processing, this work highlights the potential of silicon photonics for 200 Gbps/λ Co-Packaged Optics (CPO) and Linear Pluggable Optics (LPO) applications. The findings underscore the enhanced signal integrity, power efficiency, and reduced latency achieved with FOWLP, addressing critical bottlenecks in hyperscale data centers and AI/ML clusters.","PeriodicalId":16144,"journal":{"name":"Journal of Lightwave Technology","volume":"43 4","pages":"1979-1986"},"PeriodicalIF":4.8000,"publicationDate":"2024-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747125","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Lightwave Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10747125/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Co-packaged optics (CPO) has emerged as a promising solution to address the limitations of traditional pluggable optical transceivers, offering enhanced bandwidth, improved energy efficiency, and reduced signal loss. This paper presents a low-cost, volume-manufacturable Fan-Out Wafer Level Packaging (FOWLP) silicon photonic engine with an aggregate data transmission capacity of 1.79 Tbps (8 × 224 Gbps). The FOWLP platform enables the seamless integration of Electronic ICs (EICs) and Photonic ICs (PICs) without wire bonds, preserving signal integrity and minimizing losses. By demonstrating 112 Gbaud NRZ (112 Gbps/λ) and PAM4 (224 Gbps/λ) transmission with minimal digital signal processing, this work highlights the potential of silicon photonics for 200 Gbps/λ Co-Packaged Optics (CPO) and Linear Pluggable Optics (LPO) applications. The findings underscore the enhanced signal integrity, power efficiency, and reduced latency achieved with FOWLP, addressing critical bottlenecks in hyperscale data centers and AI/ML clusters.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用于共封装光学器件的1.6 Tbps fowlp硅光子引擎
共封装光学器件(CPO)已成为解决传统可插拔光收发器局限性的一种有前途的解决方案,可提供增强的带宽、提高的能效和减少的信号损耗。本文提出了一种低成本、可量产的扇出晶圆级封装(FOWLP)硅光子引擎,其总数据传输容量为1.79 Tbps (8 × 224 Gbps)。FOWLP平台可以实现电子集成电路(eic)和光子集成电路(PICs)的无缝集成,无需线键,保持信号完整性并最大限度地减少损耗。通过展示112 Gbps/λ NRZ (112 Gbps/λ)和PAM4 (224 Gbps/λ)传输和最少的数字信号处理,这项工作强调了硅光子学在200 Gbps/λ共封装光学(CPO)和线性可插拔光学(LPO)应用中的潜力。研究结果强调了FOWLP实现的增强信号完整性、功率效率和降低延迟,解决了超大规模数据中心和AI/ML集群的关键瓶颈。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Journal of Lightwave Technology
Journal of Lightwave Technology 工程技术-工程:电子与电气
CiteScore
9.40
自引率
14.90%
发文量
936
审稿时长
3.9 months
期刊介绍: The Journal of Lightwave Technology is comprised of original contributions, both regular papers and letters, covering work in all aspects of optical guided-wave science, technology, and engineering. Manuscripts are solicited which report original theoretical and/or experimental results which advance the technological base of guided-wave technology. Tutorial and review papers are by invitation only. Topics of interest include the following: fiber and cable technologies, active and passive guided-wave componentry (light sources, detectors, repeaters, switches, fiber sensors, etc.); integrated optics and optoelectronics; and systems, subsystems, new applications and unique field trials. System oriented manuscripts should be concerned with systems which perform a function not previously available, out-perform previously established systems, or represent enhancements in the state of the art in general.
期刊最新文献
Hand Gesture Recognition is Achieved by Collecting the Deformation of Arm Muscles Using Cladding Waveguide Fiber Bragg Gratings All-Fiber Photothermal Gas Sensing Employing Two Types of Cascaded Hollow Core Fibers Study of Mueller Matrix Containing PDL/G and S-NPR Effect in SOAs Polarization-Independent Compact Waveguide Crossing on SOI Platform Large-Capacity, Multipoint Ultrasonic Transmitters Based on Balloon-Shaped Single-Mode-Fiber Structures Enabled by Fiber Bragg Gratings
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1