High-temperature pre-aging induced coherent precipitation for Concurrent strength and conductivity enhancement in Cu-Mn-Co-P alloys

Abstract

High-performance copper alloys are critical materials for next-generation electronic applications. This study investigates the effect of high-temperature pre-aging on the microstructure and properties of Cu-0.33Mn-0.31Co-0.17P (wt.%) alloy. Pre-aging promotes the formation of Guinier-Preston (GP) zones and nanoscale (Mn,Co)₂P precipitates, reducing subsequent aging temperature and enhancing precipitation kinetics. Compared to the conventional SCA process (950 °C for 30 min, cold-rolled, and aged at 500 °C for 4 h), the SPACA process (950 °C for 30 min, pre-aged at 650 °C for 10 min, cold-rolled, and aged at 360 °C for 8 h) increases tensile strength by 55 MPa and electrical conductivity by 8.1 % IACS, achieving values of 715 MPa and 70.9 % IACS. This demonstrates the potential of high-temperature pre-aging for achieving a balanced enhancement of mechanical and electrical properties in copper alloys.