Detailed microstructure and the influence of post-treatment on CVD TiAlN wear-resistant coatings

IF 4.6 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY International Journal of Refractory Metals & Hard Materials Pub Date : 2025-06-01 Epub Date: 2025-01-28 DOI:10.1016/j.ijrmhm.2025.107077
Monica Mead , Olof Bäcke , Thorsten Manns , Dirk Stiens , Mats Halvarsson
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Abstract

In this work, the growth modes of low-pressure chemical vapour deposition (LP-CVD) nano-lamellar TiAlN coatings deposited on cemented carbide substrates and the influence of blasting post-treatment on the microstructure are investigated by scanning electron microscopy (SEM), scanning transmission electron microscopy (STEM) and transmission Kikuchi diffraction (TKD). Detailed information on the microstructure is revealed and gives insight into the growth mechanisms during deposition. Local information on the influence of blast-treatment on the micro- and nanostructure reveals how the material is influenced by external stresses on a microstructural level.
Two distinct surface morphologies corresponding to specific grain orientations with <111> and <110> directions parallel to the coating normal are observed. Additionally, a growth mechanism is proposed, which suggests that the surface reaction kinetics are influenced by the detailed microstructure of the grains, leading to locally varying Al/Ti ratios. Blast-treatment of the TiAlN coatings leads to bending and intermixing of the nano-lamellae, where the direct visualization of the lamellae enabled the estimation of the deformation. Continuous lattice rotations were observed in the near-surface region, where the magnitude of the lattice rotation in areas with a high orientation density of <110> directions was more pronounced as compared to areas with a high orientation density of <111> directions. This could be related to the local Schmid factors.

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详细的显微组织及后处理对CVD TiAlN耐磨涂层的影响
本文采用扫描电镜(SEM)、扫描透射电镜(STEM)和透射Kikuchi衍射(TKD)研究了低压化学气相沉积(LP-CVD)纳米层状TiAlN涂层在硬质合金基体上的生长方式以及爆破后处理对其微观结构的影响。揭示了微观结构的详细信息,并深入了解了沉积过程中的生长机制。关于爆破处理对微观和纳米结构影响的局部信息揭示了材料如何在微观结构水平上受到外部应力的影响。两种不同的表面形态对应于特定的晶粒取向<;111>;和& lt; 110年比;观察与涂层法线平行的方向。此外,还提出了生长机制,表明表面反应动力学受到晶粒微观结构的影响,导致局部Al/Ti比变化。TiAlN涂层的爆破处理导致纳米片层的弯曲和混合,其中片层的直接可视化使变形的估计成为可能。在近表面区域观察到连续的晶格旋转,其中高取向密度区域的晶格旋转幅度为<;110>;相对于取向密度较高的区域(<111>;的方向。这可能与局部施密德因素有关。
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来源期刊
CiteScore
7.00
自引率
13.90%
发文量
236
审稿时长
35 days
期刊介绍: The International Journal of Refractory Metals and Hard Materials (IJRMHM) publishes original research articles concerned with all aspects of refractory metals and hard materials. Refractory metals are defined as metals with melting points higher than 1800 °C. These are tungsten, molybdenum, chromium, tantalum, niobium, hafnium, and rhenium, as well as many compounds and alloys based thereupon. Hard materials that are included in the scope of this journal are defined as materials with hardness values higher than 1000 kg/mm2, primarily intended for applications as manufacturing tools or wear resistant components in mechanical systems. Thus they encompass carbides, nitrides and borides of metals, and related compounds. A special focus of this journal is put on the family of hardmetals, which is also known as cemented tungsten carbide, and cermets which are based on titanium carbide and carbonitrides with or without a metal binder. Ceramics and superhard materials including diamond and cubic boron nitride may also be accepted provided the subject material is presented as hard materials as defined above.
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