Functional support structure-based high thermal performance L-shaped ultra-thin vapor chamber design and evaluation

Abstract

Ultra-thin vapor chambers are widely used in various applications due to their high thermal conductivity. However, their performance is often limited by structural challenges, especially when heat and cold sources are not on the same plane. The 3D molding process typically leads to significant cover collapse in ultra-thin designs, increasing vapor resistance, reducing heat transfer efficiency, and potentially causing vapor chamber failure. This paper introduces an innovative L-shaped ultra-thin vapor chamber with integrated functional support structures. These strategically placed support structures effectively reduce vapor resistance caused by cover collapse. Comprehensive thermal performance tests show that the proposed method achieves exceptional results, with a maximum thermal conductivity of 8233.82 W/m·K and a maximum power limit of 40 W. These improvements represent a 333.97 % increase in thermal conductivity and a 100 % increase in power limit compared to conventional designs, marking a significant advancement in the thermal performance of L-shaped ultra-thin vapor chambers.