Fabrication of high-thermal-conductivity and low-dielectric boron Nitride/Quartz Fiber/Epoxy composites

Abstract

This study developed a high-thermal-conductivity, low-dielectric composite material by incorporating hexagonal boron nitride (BN) into quartz fiber-reinforced epoxy resin and optimizing the autoclave-molding for BN alignment, thereby significantly enhancing the material’s thermal conductivity. Experimental results demonstrated that the ordered arrangement of BN platelets within the layered structure effectively constructed efficient thermal conduction pathways. When 30 wt% BN platelets were introduced into the resin, the in-plane and through-plane thermal conductivities of the composite reached 4.20 W·m^-1·K^-1 and 1.26 W·m^-1·K^-1, respectively. Additionally, the effects of BN content on the mechanical and dielectric properties of the composite were investigated. This study provides valuable theoretical insights and process guidance for designing and fabricating high-thermal-conductivity and low-dielectric composites for thermal management applications in electric vehicles.