Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-18 DOI:10.1109/TSM.2024.3492173
Pin-Yen Liao;Tee Lin;Omid Ali Zargar;Jhang-Kun Li;Yang-Cheng Shih;Shih-Cheng Hu;Graham Leggett
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Abstract

recent developments in semiconductor manufacturing have seen feature sizes reduce to as small as 3 nm. It is predicted that 2 nm, or even 1 nanometer will be achieved soon. Improving the level of cleanliness of the wafer mask during manufacturing can lead to improved product yield and quality. The quality of lithography technology and the reticle is one of the most important items in the wafer manufacturing process. The cleanliness of this process directly affects the wafer quality and yield. Because the wafer manufacturing process involves the stacking of multiple reticles through lithography technology, semiconductor factories mostly use a reticle stocker room to store the photomasks. However, the reticle is susceptible to defects caused by moisture, particles, and molecular contaminants in the air. Therefore, the reticle stocker room environment requires high cleanliness and humidity control. In this study, the flow stream lines, velocity and humidity fields associated with a flow isolation device (FID) installed in a reticle stocker room were analyzed with the assistance of computational fluid dynamics (CFD) software developed by ANSYS Fluent. Different velocity (V=1 m/s, 1.5 m/s, 2 m/s) of the flow isolation device were examined. The results show that under the same velocity (V=1 m/s), the wider the outlet width of the flow isolation device (W ${=}0$ .2 m), the higher the isolation efficiency ( $\eta {=}83.9$ %). The results also show that the faster the velocity of the flow isolation device (V =2 m/s), the better the isolation efficiency ( $\eta {=}88.2$ %) under the same outlet width (W ${=}0$ .1 m). The use of the flow isolation device can effectively reduce the supply of clean dry air (CDA) by up to 40%, greatly reducing energy consumption during semiconductor manufacturing. According to the results of this study, when using both a hollow fiber adsorption dryer and a flow isolation device with a width of 0.1 m and an outlet wind speed of 2 m/s, it can save 118,514 kWh per year, and its energy saving rate is 92.03%.
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用流动隔离装置(FID)防止半导体制造厂掩膜自动存储系统(库房)的水分侵入
半导体制造的最新发展已经看到特征尺寸缩小到3nm。预计不久将达到2nm,甚至1nm。在制造过程中提高晶圆掩膜的清洁度可以提高产品的产量和质量。光刻工艺和光刻线的质量是晶圆制造过程中最重要的环节之一。该工艺的清洁度直接影响到晶圆片的质量和成品率。由于晶圆制造过程涉及通过光刻技术堆叠多个光刻线,半导体工厂大多使用光刻线仓库来存储光罩。然而,由于空气中的湿气、颗粒和分子污染物,该标尺容易产生缺陷。因此,网线库房环境要求较高的洁净度和湿度控制。利用ANSYS Fluent软件开发的计算流体动力学(CFD)软件,对安装在十字线仓库内的流动隔离装置(FID)的流线、速度场和湿度场进行了分析。考察了不同流速(V=1 m/s、1.5 m/s、2 m/s)下的流动隔离装置。结果表明:在相同流速下(V=1 m/s),流动隔离装置出口宽度越宽(W ${=}0$ 0.2 m),隔离效率越高($\eta{=}83.9$ %)。结果还表明,在相同出口宽度(W ${=}0$ 0.1 m)下,流动隔离装置的速度越快(V =2 m/s),隔离效率越好($\eta{=}88.2$ %),使用流动隔离装置可有效减少清洁干燥空气(CDA)的供气量高达40%,大大降低了半导体制造过程中的能耗。根据本研究结果,同时使用中空纤维吸附式干燥机和宽度为0.1 m、出口风速为2 m/s的气流隔离装置时,每年可节电118514千瓦时,节能率为92.03%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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