Dipole-Enhanced Low Thermal Budget Amorphous InWO TFT Achieving a Steep Subthreshold Swing of 40 mV/Decade Without Ferroelectric Layer

IF 4.5 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2025-01-20 DOI:10.1109/LED.2025.3532255
Zefu Zhao;Kai-Jhih Gan;Shenglin Pan;Shaohao Wang;Tiaoyang Li;Dun-Bao Ruan
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Abstract

This work demonstrates a low thermal budget amorphous InWO ( $\alpha $ -IWO) thin film transistor (TFT) achieving a subthreshold swing (S.S.) of 40 mV/decade without utilizing a ferroelectric gate oxide. The oxygen vacancies in $\alpha $ -IWO induce the formation of an interfacial dipole layer at the surface between $\alpha $ -IWO and SiO2/HfO2. The TFT with dipole-rich interface exhibits the S.S. value below 60 mV/decade over 2 decades of drain current. X-ray diffraction (XRD) confirmed the absence of the ferroelectric orthorhombic phase in the HfO2 layer. Besides, the low thermal budget $\alpha $ -IWO TFT also exhibits a high field effect mobility of 97 cm2/V $\cdot $ s and a large on/off current ratio of 1.8E6, while the process temperature is as low as $300~^{\circ }$ C.
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偶极子增强的低热收支非晶InWO TFT实现了40 mV/ 10年的陡峭亚阈值摆动,没有铁电层
本研究展示了一种低热预算的非晶InWO ($\alpha $ -IWO)薄膜晶体管(TFT),在不使用铁电栅氧化物的情况下实现了40 mV/ 10年的亚阈值摆幅(S.S.)。$\ α $ -IWO中的氧空位诱导$\ α $ -IWO与SiO2/HfO2表面形成界面偶极子层。具有富偶极子界面的TFT在漏极电流的20年时间内S.S.值低于60 mV/ 10年。x射线衍射(XRD)证实了HfO2层中不存在铁电正交相。此外,低热预算$\alpha $ -IWO TFT还表现出高的场效应迁移率(97 cm2/V $\cdot $ s)和大的通断电流比(1.8E6),而工艺温度低至$300~^{\circ}$ C。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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