Development and Characterization of Novel Hybrid Particleboard Made from Several Non-Wood Lignocellulosic Materials.

Abstract

The green transition trend in the wood-based panel industry aims to reduce environmental impact and waste production, and it is a viable approach to meet the increasing global demand for wood and wood-based materials as roundwood availability decreases, necessitating the development of composite products as alternatives to non-wood lignocellulosic raw materials. As a result, the purpose of this study is to examine and assess the physical, mechanical, and acoustic properties of particleboard manufactured from non-wood lignocellulosic biomass. The core layer was composed of non-wood lignocelluloses (banana stem, rice straw, coconut fiber, sugarcane bagasse, and fibrous vascular bundles (FVB) from snakefruit fronds), whereas the surface was made of belangke bamboo (Gigantochloa pruriens) and wood. The chemical characteristics, fiber dimensions and derivatives, and contact angles of non-wood lignocellulosic materials were investigated. The contact angle, which ranged from 44.57 to 62.37 degrees, was measured to determine the wettability of these materials toward adhesives. Hybrid particleboard (HPb) or sandwich particleboard (SPb) samples of 25 cm × 25 cm with a target density of 0.75 g/cm³ and a thickness of 1 cm were manufactured using 7% isocyanate adhesive (based on raw material oven dry weight). The physical parameters of the particleboard, including density, water content, water absorption (WA), and thickness swelling (TS), ranged from 0.47 to 0.79 g/cm³, 6.57 to 13.78%, 16.46 to 103.51%, and 3.38 to 39.91%, respectively. Furthermore, the mechanical properties of the particleboard, including the modulus of elasticity (MOE), bending strength (MOR), and internal bond strength (IB), varied from 0.39 to 7.34 GPa, 6.52 to 87.79 MPa, and 0.03 to 0.69 MPa, respectively. On the basis of these findings, the use of non-wood lignocellulosic raw materials represents a viable alternative for the production of high-performance particleboard.