Mechanism study of micro-jet generation induced by acoustic cavitation

Abstract

Due to the continuous enhancement of wafer processing precision requirements in the semiconductor industry, ultrasonic cleaning technology has garnered significant attention for its distinctive advantages in wafer cleaning processes. This study aims to investigate the mechanism of ultrasonic cavitation during wafer processing, with a specific focus on the dynamic behavior of transient and steady-state cavitation at varying ultrasonic frequencies, as well as the distribution characteristics of the flow field during acoustic cavitation. In this paper, we comprehensively analyze the mechanism by which microjet impact generates a robust shear force for efficient particle removal from solid surfaces, while quantitatively evaluating the effects of different microjet velocities on wall deformation and potential damage. This research not only enhances our understanding of acoustic cavitation cleaning principles but also provides substantial scientific support for enhancing precision device cleaning efficiency and reducing potential damage.