Min Huang , Ruibang Xie , Zhiqian Wang , Chiyu Wen , Nizao Kong , Chenming Feng , Kaiwen Hou , Zongyun Shao , Fei Han
{"title":"Conformal Al2O3 coating layer improves electrical insulation of the oriented carbon fibers arrays for highly thermally conductive interface materials","authors":"Min Huang , Ruibang Xie , Zhiqian Wang , Chiyu Wen , Nizao Kong , Chenming Feng , Kaiwen Hou , Zongyun Shao , Fei Han","doi":"10.1016/j.compscitech.2025.111128","DOIUrl":null,"url":null,"abstract":"<div><div>Mesophase pitch-based carbon fiber is highly sought after in electronic packaging applications due to its excellent thermal conductivity and mechanical properties. However, its poor electrical insulation limits its usage in certain electronic packaging applications. Herein, the carbon fiber is coated with insulating alumina (Al<sub>2</sub>O<sub>3</sub>) ceramic to improve the insulation properties of the thermal interface materials. The Al<sub>2</sub>O<sub>3</sub> coating is formed directly onto the surface of carbon fiber using the sol-gel method and subsequent heat treatment, which substantially improves the insulation of the carbon fiber with an increased powder resistivity of nearly 42 times. Subsequently, the thermally conductive carbon fiber fillers are neatly aligned in the silicone rubber matrix along the vertical direction of heat transfer, which results in excellent properties of the prepared thermally conductive pads. The carbon fiber-filled pads exhibit a high thermal conductivity of 14.17 W m<sup>−1</sup> K<sup>−1</sup>, a high resistivity of 1.12 × 10<sup>10</sup> Ω cm, a medium breakdown voltage of 2.4 kV mm<sup>−1</sup>, and a favorable compression ratio (@45 psi) of 54.7 %. This work offers a feasible approach for the development of carbon fiber fillers with integrated thermal conductivity and electrical insulation, leading to the expanded application of carbon fiber in electronic packaging.</div></div>","PeriodicalId":283,"journal":{"name":"Composites Science and Technology","volume":"264 ","pages":"Article 111128"},"PeriodicalIF":8.3000,"publicationDate":"2025-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S026635382500096X","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
引用次数: 0
Abstract
Mesophase pitch-based carbon fiber is highly sought after in electronic packaging applications due to its excellent thermal conductivity and mechanical properties. However, its poor electrical insulation limits its usage in certain electronic packaging applications. Herein, the carbon fiber is coated with insulating alumina (Al2O3) ceramic to improve the insulation properties of the thermal interface materials. The Al2O3 coating is formed directly onto the surface of carbon fiber using the sol-gel method and subsequent heat treatment, which substantially improves the insulation of the carbon fiber with an increased powder resistivity of nearly 42 times. Subsequently, the thermally conductive carbon fiber fillers are neatly aligned in the silicone rubber matrix along the vertical direction of heat transfer, which results in excellent properties of the prepared thermally conductive pads. The carbon fiber-filled pads exhibit a high thermal conductivity of 14.17 W m−1 K−1, a high resistivity of 1.12 × 1010 Ω cm, a medium breakdown voltage of 2.4 kV mm−1, and a favorable compression ratio (@45 psi) of 54.7 %. This work offers a feasible approach for the development of carbon fiber fillers with integrated thermal conductivity and electrical insulation, leading to the expanded application of carbon fiber in electronic packaging.
期刊介绍:
Composites Science and Technology publishes refereed original articles on the fundamental and applied science of engineering composites. The focus of this journal is on polymeric matrix composites with reinforcements/fillers ranging from nano- to macro-scale. CSTE encourages manuscripts reporting unique, innovative contributions to the physics, chemistry, materials science and applied mechanics aspects of advanced composites.
Besides traditional fiber reinforced composites, novel composites with significant potential for engineering applications are encouraged.