High-Performance Flexible Pressure Sensor Based on Biomimetic Grasshopper Leg Structure for Wearable Devices and Human-Machine Interaction

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-24 DOI:10.1109/TED.2025.3527948
Honglin Chen;Weiqiang Hong;Qiang Long;Xianghui Li;Ming Hou;Xiaowen Zhu;Zihan Lin;Xinyue Wang;Hao Hou;Yunong Zhao;Qi Hong;Wenrui Xu;Xiangchen Zhao;Xiaohui Guo
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Abstract

High-performance flexible pressure sensors are crucial for achieving precise tactile sensing and play an indispensable role in human motion detection and human-machine interaction. In this study, a new low-cost flexible capacitive pressure sensor (CPS) is designed using the bionic microstructure of a grasshopper leg with polydimethylsiloxane (PDMS) as the dielectric layer. Through finite element simulation and structural optimization, the CPS can achieve high sensitivity (0.925 kPa $^{-{1}}$ ), a wide pressure sensing range (5 Pa–388 kPa), fast response time (30 ms), excellent consistency across sensor batches, and outstanding stability. Additionally, the study demonstrates the CPS’s capabilities in intelligent robots manipulator operations, human hand grasping objects with tactile feedback, human motion posture detection, and information transfer of Morse code in practical applications. Given the outstanding performance of the CPS, it is poised to be a preferred choice for future wearable devices and human-machine interaction.
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基于仿生蚱蜢腿结构的可穿戴设备及人机交互高性能柔性压力传感器
高性能柔性压力传感器是实现精确触觉感知的关键,在人体运动检测和人机交互中发挥着不可或缺的作用。本研究利用蝗虫腿的仿生微观结构,以聚二甲基硅氧烷(PDMS)为介电层,设计了一种新型的低成本柔性电容式压力传感器(CPS)。通过有限元仿真和结构优化,CPS具有高灵敏度(0.925 kPa $^{-{1}}$)、宽压力传感范围(5 Pa-388 kPa)、快速响应时间(30 ms)、优异的传感器批次一致性和出色的稳定性。此外,该研究还验证了CPS在智能机器人操纵操作、人类手部触觉反馈抓取物体、人体运动姿态检测以及莫尔斯电码信息传递等实际应用中的能力。鉴于CPS的卓越性能,它有望成为未来可穿戴设备和人机交互的首选。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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