Physical Compact Model for Source-Gated Transistors for DC Application

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-28 DOI:10.1109/TED.2024.3523885
Patryk Golec;Eva Bestelink;Radu A. Sporea;Benjamin Iñiguez
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Abstract

We present the first physical compact model for an amorphous silicon source-gated transistor (SGT) with variable Schottky barrier height. The previously published empirical compact model and TCAD model of an SGT are used to identify dominant effects present. The compact model is then validated on real device measurements. The compact model aims to operate under common conditions and typically desirable regimes of operation for an SGT, such as the flat saturation regime occurring at a particularly low saturation voltage. The dominant injection mechanisms occur through thermionic and thermionic field emission, which are the contact effects present in an SGT. Thermionic emission tends to be dominant under most common conditions. The model is suitably accurate to be used as a representation of an SGT in a SPICE simulation. This can be seen as a first step toward analog circuit design with SGTs as compact models enable circuit designers to utilize new and unique devices.
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直流应用源极晶体管的物理紧凑模型
我们提出了具有可变肖特基势垒高度的非晶硅源门控晶体管(SGT)的第一个物理紧凑模型。利用以往发表的经验紧凑模型和TCAD模型来确定存在的优势效应。然后在实际设备测量上验证了紧凑模型。紧凑型模型旨在在SGT的常见条件和典型理想运行状态下运行,例如在特别低的饱和电压下发生的平坦饱和状态。主要的注入机制是通过热离子和热离子场发射,这是sst中存在的接触效应。在大多数常见条件下,热离子发射往往占主导地位。该模型具有相当的精度,可以作为SPICE模拟中SGT的表示。这可以看作是sgt模拟电路设计的第一步,因为紧凑的模型使电路设计人员能够利用新的和独特的设备。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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