Flexible Inverter Based on Ambipolar OFETs Compatible With Finite Element Analysis

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-24 DOI:10.1109/TED.2025.3526561
Xuemeng Hu;Jialin Meng;Hao Zhu;Tianyu Wang;Qingqing Sun;David Wei Zhang;Lin Chen
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Abstract

With the demand for wearable integrated circuits in the field of flexible electronic, ambipolar organic field-effect transistors (OFETs) acting as both n-type and p-type performances are attracting more and more attention. In this article, a flexible inverter comprised of two identical ambipolar transistors was fabricated on the flexible muscovite substrate. The entire fabrication process for ambipolar transistors remains below 300°C, ensuring compatibility with backend-of-the-line (BEOL). The ambipolar transistor exhibits typical V-shape transfer curve with distinct branches for hole and electron transport, along with a comprehensive ambipolar region. The software ABAQUS was used to analyze the distribution of stress for the ambipolar transistor. Meanwhile, the ambipolar inverter comprised of the transistors can work for both positive and negative supply voltages ( ${V} _{\text {DD}}$ ) depending on input voltage ( ${V} _{\text {IN}}$ ). Furthermore, the inverter is highly flexible, which can work stably under different bending states. The proposed flexible inverter provides a possibility of application for flexible wearable integrated circuits.
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基于双极ofet的柔性逆变器与有限元分析兼容
随着柔性电子领域对可穿戴集成电路的需求,兼具n型和p型性能的双极性有机场效应晶体管(ofet)越来越受到人们的关注。本文在柔性白云母衬底上制作了由两个相同的双极晶体管组成的柔性逆变器。双极晶体管的整个制造过程保持在300°C以下,确保与后端(BEOL)的兼容性。双极晶体管具有典型的v型转移曲线,具有空穴和电子输运的不同分支,以及一个全面的双极区。利用ABAQUS软件对双极晶体管的应力分布进行了分析。同时,由晶体管组成的双极逆变器可以工作在正负电源电压(${V} _{\text {DD}}$)下,取决于输入电压(${V} _{\text {IN}}$)。此外,逆变器具有很高的灵活性,可以在不同的弯曲状态下稳定工作。所提出的柔性逆变器为柔性可穿戴集成电路的应用提供了可能。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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